Inventor
WEI-DE HO
Inventor
TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices24%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
H10DInorganic electric semiconductor devices14%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices10%
H01JElectric discharge tubes or discharge lamps10%
H10BElectronic memory devices10%
H10NElectric solid-state devices not otherwise provided for10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
PatentTitleYear
12,581,916Etch monitoring and performing202612,374,588Method for evaluating non-uniform stress202512,324,164Alignment mark for MRAM device and method202512,120,886Memory device and manufacturing method thereof202412,119,271Backside gate contact, backside gate etch stop layer, and methods of forming same202411,804,410Thin-film non-uniform stress evaluation202311,749,570Etch monitoring and performing2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (7)· patent assignee history
2023–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 7 | 2023–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 7 | 2023–2026 |