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Inventor

Tetsuya Nagaoka

Inventor
Kanagawa, JP

Overview

4→
Patents
1991–2005
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
6,960,494'Semiconductor package and method of manufacturing the same'20056,836,012'Semiconductor package and method of manufacturing the same'20045,292,050'Wire bonder'19945,045,919'Plastic packaged semiconductor device having bonding wires which are prevented from coming into contact with each other in plastic sealing step'1991

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1991–2005Patents assigned to TOSHIBA KK (3)· patent assignee history
1991–1994Based in Yokohama, JP· patent location history
1994Patents assigned to KABUSHUKI KAISHA TOSHIBA (1)· patent assignee history
2004–2005Based in Kanagawa, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOSHIBA KK31991–2005
KABUSHUKI KAISHA TOSHIBA11994
Locations
LocationPatentsSpan
Kanagawa, JP22004–2005
Yokohama, JP21991–1994