Inventor

Pai-Wei Wang

Inventor
Hsinchu, TW

Overview

3→
Patents
2016–2020
Patent span
Physics
Primary field (CPC G)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices22%
G06FElectric digital data processing22%
H04LTransmission of digital information, e.g. telegraphic communication11%
H10DInorganic electric semiconductor devices11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications11%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use11%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2016Patents assigned to IND TECH RES INST (1)· patent assignee history
2016Based in Taoyuan County, TW· patent location history
2019–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history
2019Based in Taoyuan, TW· patent location history
2020Based in Hsinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD22019–2020
IND TECH RES INST12016
Locations
LocationPatentsSpan
Hsinchu, TW12020
Taoyuan, TW12019
Taoyuan County, TW12016