Inventor
Isao Hayakawa
Inventor
Tokyo, JP
Overview
Patents· 1 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing100%
PatentTitleYear
8,078,306'Polishing apparatus and polishing method'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011Patents assigned to ASHIHARA TAKESHI (1)· patent assignee history
2011Patents assigned to EBARA CORP (1)· patent assignee history
2011Patents assigned to HAYAKAWA ISAO (1)· patent assignee history
2011Patents assigned to HAYASHI EISAKU (1)· patent assignee history
2011Patents assigned to MIYAKE YOSHIAKI (1)· patent assignee history
2011Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ASHIHARA TAKESHI | 1 | 2011 |
| EBARA CORP | 1 | 2011 |
| HAYAKAWA ISAOself | 1 | 2011 |
| HAYASHI EISAKU | 1 | 2011 |
| MIYAKE YOSHIAKI | 1 | 2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 1 | 2011 |