Inventor

Lih-Ping Li

Inventor

Hsinchu, TW

Overview

2002–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 18 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1044%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1031%

C23CCoating metallic material11%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%

C01BNon-metallic elements3%

H01LSemiconductor devices3%

H10DInorganic electric semiconductor devices3%

PatentTitleYear

10,998,452Semiconductor device having a lateral semiconductor heterojunction and method2021 7,897,505'Method for enhancing adhesion between layers in BEOL fabrication'2011 7,456,093'Method for improving a semiconductor device delamination resistance'2008 7,320,945'Gradient low k material'2008 7,288,284'Post-cleaning chamber seasoning method'2007 7,001,833'Method for forming openings in low-k dielectric layers'2006 6,962,869'SiOCH low k surface protection layer formation by CxHy gas plasma treatment'2005 6,958,524'Insulating layer having graded densification'2005 6,924,242'SiOC properties and its uniformity in bulk for damascene applications'2005 6,884,659'Thin interface layer to improve copper etch stop'2005 6,867,126'Method to increase cracking threshold for low-k materials'2005 6,812,043'Method for forming a carbon doped oxide low-k insulating layer'2004 6,770,570'Method of forming a semiconductor device with a substantially uniform density low-k dielectric layer'2004 6,756,321'Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant'2004 6,753,269'Method for low k dielectric deposition'2004 6,623,654'Thin interface layer to improve copper etch stop'2003 6,602,780'Method for protecting sidewalls of etched openings to prevent via poisoning'2003 6,426,371'Sol materials'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002Patents assigned to CHINESE PETROLEUM CORP (1)· patent assignee history

2002Patents assigned to IND TECH RES INST (1)· patent assignee history

2002Patents assigned to TAIWAN FERTILIZER CO LTD (1)· patent assignee history

2002–2003Based in Taipei, TW· patent location history

2003–2011Patents assigned to TAIWAN SEMICONDUCTOR MFG (16)· patent assignee history

2003–2011Based in Hsinchu, TW· patent location history

2021Patents assigned to UNIV KING ABDULLAH SCI & TECH (1)· patent assignee history

2021Based in Thuwal, SA· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG	16	2003–2011
CHINESE PETROLEUM CORP	1	2002
IND TECH RES INST	1	2002
TAIWAN FERTILIZER CO LTD	1	2002
UNIV KING ABDULLAH SCI & TECH	1	2021

Locations

Location	Patents	Span
Hsinchu, TW	15	2003–2011
Taipei, TW	2	2002–2003
Thuwal, SA	1	2021