Inventor
CHIE SUGAMA
Inventor
JP
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B22Fprimary
B22FWorking metallic powder20%
H01LSemiconductor devices17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
B23KSoldering or unsoldering15%
C22CAlloys10%
H01BCables7%
C09JAdhesives5%
C09DCoating compositions, e.g. paints, varnishes or lacquers2%
C23CCoating metallic material2%
H05KPrinted circuits2%
PatentTitleYear
12,564,879Copper paste for joining, method for manufacturing joined body, and joined body202611,890,681Method for producing bonded object and semiconductor device and copper bonding paste202411,887,960Member connection method202411,575,076Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module202311,532,588Copper paste for pressureless bonding, bonded body and semiconductor device202211,483,936Method for producing joined body, and joining material202211,462,502Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device202211,370,066Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to SHOWA DENKO MATERIALS CO LTD (7)· patent assignee history
2022–2024Patents assigned to HITACHI CHEMICAL CO LTD (5)· patent assignee history
2022–2026Based in JP· patent location history
2024–2026Patents assigned to RESONAC CORP (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHOWA DENKO MATERIALS CO LTD | 7 | 2022–2026 |
| HITACHI CHEMICAL CO LTD | 5 | 2022–2024 |
| RESONAC CORP | 3 | 2024–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 8 | 2022–2026 |