Inventor

Yasuo Imai

Inventor

Takasaki, JP

Overview

1993–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 29 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Dprimary

H10DInorganic electric semiconductor devices27%

G03GElectrography12%

H01RElectrically-conductive connections10%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%

B23BTurning5%

C10MLubricating compositions5%

C10NIndexing scheme associated with subclass c10m relating to lubricating compositions5%

Y10TTechnical subjects covered by former us classification5%

B21CManufacture of metal sheets, wire, rods, tubes, profiles or like semi-manufactured products otherwise than by rolling2%

B21JForging2%

PatentTitleYear

10,707,620Connector2020 9,972,938Connector2018 9,899,769'Connector with an operating member mountable in either of two opposite orientations and locks for locking the operating member at an initial position and a connection position in either orientation'2018 9,673,561'Connector and structure for fixing connector to wiring harness'2017 9,275,863'Method of fabricating semiconductor device'2016 8,888,167'Body structure of vehicle'2014 8,807,886'Hole cutter'2014 8,748,266'Method of fabricating semiconductor device'2014 8,354,713'Method of fabricating semiconductor device'2013 8,076,202'Method of fabricating semiconductor device'2011 7,414,012'Aqueous lubricant for plastic working of metallic material and method for forming lubricant film'2008 7,180,130'Method of fabricating semiconductor device'2007 6,803,281'Method of fabricating semiconductor device'2004 6,720,220'Method of fabricating semiconductor device'2004 6,512,265'Method of fabricating semiconductor device'2003 6,455,476'Composition and process for lubricated plastic working of metals'2002 6,410,959'Method of fabricating semiconductor device'2002 6,330,871'Cylinder head-integrated cylinder block and process for manufacturing the same'2001 6,307,231'Method of fabricating semiconductor device'2001 6,168,996'Method of fabricating semiconductor device'2001 6,094,550'Developing apparatus'2000 5,988,956'Hole cutter'1999 D0394450'Developing unit for printer and facsimile'1998 5,640,651'Developing device'1997 5,618,486'Process for manufacturing a heat-resistant molded foam product'1997 5,545,771'Process for preparation of gem-difluoroalkanes'1996 5,243,389'Toner hopper having stirring and feeding rollers'1993 5,239,805'Method of packing a developer cartridge'1993 5,235,130'Developer cartridge'1993

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1993–2000Patents assigned to SHARP KK (6)· patent assignee history

1993–2000Based in Nara, JP· patent location history

1993–1997Based in Kitakatsuragi-gun, JP· patent location history

1999–2014Based in Anjo, JP· patent location history

2001–2016Patents assigned to HITACHI ULSI SYS CO LTD (11)· patent assignee history

2001–2003Patents assigned to HITACHI LTD (4)· patent assignee history

2001–2016Based in Takasaki, JP· patent location history

2011–2014Patents assigned to IMAI YASUO (5)· patent assignee history

2011–2016Patents assigned to RENESAS ELECTRONICS CORP (4)· patent assignee history

2017–2020Based in Mie, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HITACHI ULSI SYS CO LTD	11	2001–2016
SHARP KK	6	1993–2000
IMAI YASUOself	5	2011–2014
HITACHI LTD	4	2001–2003
RENESAS ELECTRONICS CORP	4	2011–2016

Locations

Location	Patents	Span
Takasaki, JP	10	2001–2016
Nara, JP	5	1993–2000
Mie, JP	4	2017–2020
Anjo, JP	2	1999–2014
Kitakatsuragi-gun, JP	2	1993–1997