Inventor
Ryoichi Oguro
Inventor
Imaichi, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits31%
Y10TTechnical subjects covered by former us classification23%
B29CShaping or joining of plastics8%
B29LIndexing scheme associated with subclass b29c, relating to particular articles8%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form8%
C25DProcesses for the electrolytic or electrophoretic production of coatings8%
C25FProcesses for the electrolytic removal of materials from objects8%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
PatentTitleYear
5,792,333'Method of surface-roughening treatment of copper foil'19985,413,838'Both-side roughened copper foil with protection film'19955,320,919'Copper foil for inner layer circuit of multi-layered printed circuit board, method of producing the same and multi-layered printed circuit board having the same'19945,286,330'Method of producing copper-clad laminated board'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–1998Patents assigned to CIRCUIT FOIL JAPAN (4)· patent assignee history
1994–1995Patents assigned to SUMITOMO BAKELITE CO (3)· patent assignee history
1994–1998Based in Imaichi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CIRCUIT FOIL JAPAN | 4 | 1994–1998 |
| SUMITOMO BAKELITE CO | 3 | 1994–1995 |
Locations
| Location | Patents | Span |
|---|---|---|
| Imaichi, JP | 4 | 1994–1998 |