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Inventor

Hsiu-Nien Lin

Inventor
Taichung, TW

Overview

6→
Patents
2008–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 6 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
B25GHandles for hand implements9%
F16CShafts9%
F16DCouplings for transmitting rotation9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
LOC089%
LOC159%
Y10TTechnical subjects covered by former us classification9%
PatentTitleYear
11,049,832Formation method of package structure with warpage-control element202111,024,594Substrate and package structure20218,366,339'Two-section tool joint'2013D0602056'Tool bit'2009D0582230'Connector tool collar'20087,444,908'Tool handle drivable by other tool'2008

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2008–2013Patents assigned to LIN HSIU-NIEN (3)· patent assignee history
2008Patents assigned to LIN HSIU NIEN (1)· patent assignee history
2008–2013Based in Taichung, TW· patent location history
2008Based in Taipei, TW· patent location history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history
2021Based in Zhubei City, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
LIN HSIU-NIENself32008–2013
TAIWAN SEMICONDUCTOR MFG CO LTD22021
LIN HSIU NIENself12008
Locations
LocationPatentsSpan
Taichung, TW32008–2013
Zhubei City, TW22021
Taipei, TW12008