Inventor
Xiaoyun WEI
Inventor
CN
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices31%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
B29CShaping or joining of plastics8%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering8%
C12MApparatus for enzymology or microbiology8%
H10KOrganic electric solid-state devices8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
Y02PClimate change mitigation technologies in the production or processing of goods8%
PatentTitleYear
12,472,684Three-dimensional forming method and system202512,341,116Chip package structure, preparation method, and electronic device202511,862,529Chip and manufacturing method thereof, and electronic device202411,776,820Vertical interconnection structure and manufacturing method thereof, packaged chip, and chip packaging method202311,322,701High dielectric constant composite material and application thereof2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022Patents assigned to UNIV PEKING SHENZHEN GRADUATE SCHOOL (1)· patent assignee history
2022–2025Based in CN· patent location history
2023–2025Patents assigned to HUAWEI TECH CO LTD (3)· patent assignee history
2025Patents assigned to REGENOVO BIOTECHNOLOGY CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HUAWEI TECH CO LTD | 3 | 2023–2025 |
| REGENOVO BIOTECHNOLOGY CO LTD | 1 | 2025 |
| UNIV PEKING SHENZHEN GRADUATE SCHOOL | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 5 | 2022–2025 |