Inventor
Shih-Ping Hsu
Inventor
Hsinchu, TW
Overview
Patents· 145 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H05KPrinted circuits26%
H01LSemiconductor devices15%
Y10TTechnical subjects covered by former us classification10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
Y02PClimate change mitigation technologies in the production or processing of goods3%
G02BOptical elements, systems or apparatus1%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation1%
C25DProcesses for the electrolytic or electrophoretic production of coatings1%
G06KGraphical data reading1%
PatentTitleYear
10,784,205Electronic package202010,745,818Method of fabricating package substrates202010,580,739Package substrate and associated fabrication method with varying depths for circuit device terminals202010,483,194Interposer substrate and method of fabricating the same201910,483,232Method for fabricating bump structures on chips with panel type process201910,475,752Semiconductor package structure and method of making the same201910,475,765Interposer substrate and method for manufacturing the same201910,361,160Package structure and its fabrication method201910,347,575Package substrate and its fabrication method201910,283,442Interposer substrate and method of fabricating the same201910,269,841Sensor package and method of manufacturing the same201910,204,865Electronic package and conductive structure thereof201910,117,340Manufacturing method of package substrate with metal on conductive portions201810,079,190Methods of fabricating an electronic package structure201810,079,220Package substrate having a plurality of chips electrically connected by conductive vias and wiring bonding201810,062,649Package substrate201810,014,242Interposer substrate and method of fabricating the same201810,002,823Packaging substrate and method of fabricating the same20189,992,879Package substrate with metal on conductive portions and manufacturing method thereof20189,972,599Package structure and method of manufacturing the same20189,941,208Substrate structure and manufacturing method thereof20189,905,503'Package stucture and method of fabricating the same'20189,893,003'Package substrate and flip-chip package circuit including the same'20189,831,165'Interposer substrate and method of manufacturing the same'20179,831,217Method of fabricating package substrates20179,824,964'Package substrate, package structure including the same, and their fabrication methods'20179,806,012'IC carrier of semiconductor package and manufacturing method thereof'20179,805,996'Substrate structure and manufacturing method thereof'20179,754,982'Packaging module and substrate structure thereof'20179,750,142'Method for manufacturing an electronic package'20179,741,646'Package substrate and its fabrication method'20179,730,328'Printed circuit board with embedded component and method for manufacturing same'20179,711,445'Package substrate, package structure including the same, and their fabrication methods'20179,613,894'Electronic package'20179,601,402'Package apparatus and manufacturing method thereof'20179,589,935'Package apparatus and manufacturing method thereof'20179,583,436'Package apparatus and manufacturing method thereof'20179,548,234'Package substrate and flip-chip package circuit including the same'20179,536,864'Package structure and its fabrication method'20179,484,224'Method of fabricating a circuit board structure'20169,370,105'Package apparatus with multiple pillar layers'20169,357,647'Packaging substrate, method for manufacturing same, and chip packaging body having same'20169,338,900'Interposer substrate and method of fabricating the same'20169,271,388'Interposer and package on package structure'20169,265,146'Method for manufacturing a multi-layer circuit board'20169,232,665'Method of fabricating packaging substrate having a passive element embedded therein'20169,214,437'Package method'20159,179,549'Packaging substrate having embedded passive component and fabrication method thereof'20159,099,450'Package structure and method for manufacturing same'20159,089,082'Printed circuit board with embedded component and method for manufacturing same'20159,024,422'Package structure having embedded semiconductor component and fabrication method thereof'20159,015,936'Method for manufacturing IC substrate'20159,000,573'Package on package structure and method for manufacturing same'20158,853,000'Package on package structrue and method for manufacturing same'20148,829,356'Packaging substrate having a passive element embedded therein and method of fabricating the same'20148,779,300'Packaging substrate with conductive structure'20148,711,572'Circuit board having semiconductor chip embedded therein'20148,709,940'Structure of circuit board and method for fabricating the same'20148,633,587'Package structure'20148,610,006'Lid for micro-electro-mechanical device and method for fabricating the same'20138,580,608'Fabrication method of package structure having embedded semiconductor component'20138,531,021'Package stack device and fabrication method thereof'20138,436,463'Packaging substrate structure with electronic component embedded therein and method for manufacture of the same'20138,399,778'Circuit board structure and fabrication method thereof'20138,227,711'Coreless packaging substrate and method for fabricating the same'20128,110,896'Substrate structure with capacitor component embedded therein and method for fabricating the same'20128,101,866'Packaging substrate with conductive structure'20128,070,932'Circuit board with identifiable information and method for fabricating the same'20118,058,105'Method of fabricating a packaging structure'20118,058,718'Package substrate embedded with semiconductor component'20118,058,721'Package structure'20118,058,566'Packaging substrate structure and manufacturing method thereof'20118,022,513'Packaging substrate structure with electronic components embedded in a cavity of a metal block and method for fabricating the same'20118,017,442'Method of fabricating a package structure'20117,973,398'Embedded chip package structure with chip support protruding section'20117,969,745'Circuit board structure having electronic components integrated therein'20117,956,472'Packaging substrate having electrical connection structure and method for fabricating the same'20117,906,850'Structure of circuit board and method for fabricating same'20117,881,070'Circuit board having power source'20117,863,729'Circuit board structure embedded with semiconductor chips'20117,858,885'Circuit board structure'20107,839,650'Circuit board structure having embedded capacitor and fabrication method thereof'20107,839,649'Circuit board structure having embedded semiconductor element and fabrication method thereof'20107,820,233'Method for fabricating a flip chip substrate structure'20107,817,441'Circuit board'20107,812,460'Packaging substrate and method for fabricating the same'20107,754,538'Packaging substrate structure with electronic components embedded therein and method for manufacturing the same'20107,719,104'Circuit board structure with embedded semiconductor chip and method for fabricating the same'20107,718,470'Package substrate and method for fabricating the same'20107,706,148'Stack structure of circuit boards embedded with semiconductor chips'20107,705,446'Package structure having semiconductor chip embedded therein and method for fabricating the same'20107,659,193'Conductive structures for electrically conductive pads of circuit board and fabrication method thereof'20107,656,040'Stack structure of circuit board with semiconductor component embedded therein'20107,639,473'Circuit board structure with embedded electronic components'20097,629,204'Surface roughening method for embedded semiconductor chip structure'20097,626,270'Coreless package substrate with conductive structures'20097,614,146'Method for fabricating circuit board structure'20097,598,610'Plate structure having chip embedded therein and the manufacturing method of the same'20097,592,706'Multi-layer circuit board with fine pitches and fabricating method thereof'20097,582,961'Package structure with circuits directly connected to semiconductor chip'20097,546,682'Methods for repairing circuit board having defective pre-soldering bump'20097,544,599'Manufacturing method of solder ball disposing surface structure of package substrate'20097,539,022'Chip embedded packaging structure'20097,519,244'Circuit board with optoelectronic component embedded therein'20097,514,786'Semiconductor chip electrical connection structure'20097,508,006'Circuit board structure of integrated optoelectronic component'20097,485,970'Semiconductor package substrate having contact pad protective layer formed thereon'20097,453,155'Method for fabricating a flip chip package'20087,449,363'Semiconductor package substrate with embedded chip and fabrication method thereof'20087,450,793'Semiconductor device integrated with opto-electric component and method for fabricating the same'20087,446,402'Substrate structure with embedded semiconductor chip and fabrication method thereof'20087,435,618'Method to manufacture a coreless packaging substrate'20087,419,850'Method to manufacture a coreless packaging substrate'20087,396,700'Method for fabricating thermally enhanced semiconductor device'20087,382,057'Surface structure of flip chip substrate'20087,365,272'Circuit board with identifiable information and method for fabricating the same'20087,359,590'Semiconductor device integrated with optoelectronic components'20087,351,916'Thin circuit board'20087,350,298'Method for fabricating circuit board with conductive structure'20087,341,934'Method for fabricating conductive bump of circuit board'20087,321,164'Stack structure with semiconductor chip embedded in carrier'20087,319,276'Substrate for pre-soldering material and fabrication method thereof'20087,313,294'Structure with embedded opto-electric components'20077,312,405'Module structure having embedded chips'20077,302,126'Circuit board structure of integrated optoelectronic componenet'20077,276,800'Carrying structure of electronic components'20077,274,099'Method of embedding semiconductor chip in support plate'20077,242,092'Substrate assembly with direct electrical connection as a semiconductor package'20077,239,525'Circuit board structure with embedded selectable passive components and method for fabricating the same'20077,174,631'Method of fabricating electrical connection terminal of embedded chip'20077,174,630'Method for fabricating connection terminal of circuit board'20077,151,050'Method for fabricating electrical connection structure of circuit board'20067,129,117'Method of embedding semiconductor chip in support plate and embedded structure thereof'20067,112,524'Substrate for pre-soldering material and fabrication method thereof'20067,089,660'Method of fabricating a circuit board'20067,081,402'Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same'20067,050,304'Heat sink structure with embedded electronic components for semiconductor package'20067,012,019'Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same'20066,853,084'Substrate within a Ni/Au structure electroplated on electrical contact pads and method for fabricating the same'20056,649,506'Method of fabricating vias in solder pads of a ball grid array (BGA) substrate'20036,574,863'Thin core substrate for fabricating a build-up circuit board'20036,576,540'Method for fabricating substrate within a Ni/Au structure electroplated on electrical contact pads'20036,543,676'Pin attachment by a surface mounting method for fabricating organic pin grid array packages'20036,475,327'Attachment of a stiff heat spreader for fabricating a cavity down plastic chip carrier'20026,432,748'Substrate structure for semiconductor package and manufacturing method thereof'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2010Patents assigned to PHOENIX PREC TECHNOLOGY CORP (56)· patent assignee history
2002–2017Based in Taoyuan, TW· patent location history
2006–2017Based in Hsinchu, TW· patent location history
2008–2009Based in Taoyuan County, TW· patent location history
2010–2016Patents assigned to UNIMICRON TECHNOLOGY CORP (36)· patent assignee history
2011–2015Patents assigned to HSU SHIH-PING (17)· patent assignee history
2014–2016Patents assigned to ZHEN DING TECHNOLOGY CO LTD (8)· patent assignee history
2015–2020Patents assigned to PHOENIX PIONEER TECHNOLOGY CO LTD (37)· patent assignee history
2015–2020Based in Hsinchu County, TW· patent location history
2016–2018Based in Hukou, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| PHOENIX PREC TECHNOLOGY CORP | 56 | 2002–2010 |
| PHOENIX PIONEER TECHNOLOGY CO LTD | 37 | 2015–2020 |
| UNIMICRON TECHNOLOGY CORP | 36 | 2010–2016 |
| HSU SHIH-PINGself | 17 | 2011–2015 |
| ZHEN DING TECHNOLOGY CO LTD | 8 | 2014–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 70 | 2006–2017 |
| Hsinchu County, TW | 37 | 2015–2020 |
| Taoyuan, TW | 30 | 2002–2017 |
| Taoyuan County, TW | 4 | 2008–2009 |
| Hukou, TW | 3 | 2016–2018 |