Inventor
Tsung-Hsien Huang
Inventor
Hsin Chu Hsien, TW
Overview
Patents· 41 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
F28Dprimary
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact16%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application15%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
F21KNon-electric light sources using luminescence8%
F21VFunctional features or details of lighting devices or systems thereof8%
F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to the form or the kind of the light sources or of the colour of the light emitted8%
H05KPrinted circuits8%
G11CStatic stores4%
H01LSemiconductor devices4%
H10DInorganic electric semiconductor devices3%
PatentTitleYear
10,937,686Formation and in-situ treatment processes for gap fill layers202110,816,279High-efficiency water-cooled heat dissipation device202010,727,660Cable assembly and cable indication system202010,495,390Liquid cooling radiator with impurities filtering201910,276,232Read margin tracking in memory applications201910,170,487Device having an inter-layer via (ILV), and method of making same2019D0833988Heat sink201810,082,339Heat sink assembly2018D0819579Heat sink20189,934,845Latch with built-in level shifter2018D0805042'Combined heat exchanger base and embedded heat pipes'20179,797,660'Heat sink assembly'20179,664,453'Aluminum pipe and heat pipe package and its packaging method'20179,587,891'Heat sink and mounting bracket arrangement'20179,568,254'Heat transfer plate and heat pipe mounting structure and method'20179,484,350'Semiconductor device having an inter-layer via (ILV), and method of making same'20169,312,856'Scheme for 3D voltage type TSV signal transmission'20169,297,597'Combination heat sink assembly'20169,175,911'Heat sink assembly'20159,170,012'Heat sink module and omnidirectional LED lamp holder assembly using same'20159,121,587'LED lamp assembly'20159,013,908'Control scheme for 3D memory IC'20158,960,267'Heat sink module'20158,881,793'Heat pipe assembly'20148,827,509'LED lamp bulb with a retainer rim'20148,806,748'Heat pipe mounting method'20148,746,325'Non-base block heat sink'20148,585,249'Lamp holder of LED projection lamp'20138,575,826'Connection structure of LED lamp holder and heat radiation fins'20138,555,952'Heat sink with fins having angled foot portion'20138,413,713'Heat sink module with fins having Z shaped foot portions'20138,304,971'LED light bulb with a multidirectional distribution and novel heat dissipating structure'20128,303,138'LED lamp holder'20128,227,960'LED projector lamp with improved structure of radiation fins'20128,191,612'Cooler module without base panel'20128,109,322'Heat plate type cooler module'20127,992,624'Heat sink module'20117,650,929'Cooler module'20107,610,948'Cooler module'20097,441,592'Cooler module'20087,036,566'Heat dissipating module'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2017Patents assigned to HUANG TSUNG-HSIEN (29)· patent assignee history
2006–2019Based in Hsin Chu Hsien, TW· patent location history
2008–2009Based in Kuei Shan Hsiang, TW· patent location history
2015–2016Patents assigned to NAT UNIV TSING HUA (2)· patent assignee history
2015–2021Based in Hsinchu, TW· patent location history
2016–2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history
2018–2019Patents assigned to HUANG TSUNG HSIEN (4)· patent assignee history
2020Patents assigned to BKS TEC CORP (1)· patent assignee history
2020Based in Dongguan, CN· patent location history
2020Based in Zhubei City, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HUANG TSUNG-HSIENself | 29 | 2006–2017 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 5 | 2016–2021 |
| HUANG TSUNG HSIENself | 4 | 2018–2019 |
| NAT UNIV TSING HUA | 2 | 2015–2016 |
| BKS TEC CORP | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsin Chu Hsien, TW | 30 | 2006–2019 |
| Hsinchu, TW | 7 | 2015–2021 |
| Kuei Shan Hsiang, TW | 2 | 2008–2009 |
| Dongguan, CN | 1 | 2020 |
| Zhubei City, TW | 1 | 2020 |