Inventor
YUJI MURAYAMA
Inventor
US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B08Bprimary
B08BCleaning in general8%
B23CMilling8%
B23PMetal-working not otherwise provided for8%
B24BMachines, devices, or processes for grinding or polishing8%
C23CCoating metallic material8%
C23FNon-mechanical removal of metallic material from surface8%
H01JElectric discharge tubes or discharge lamps8%
H01LSemiconductor devices8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
B60LPropulsion of electrically-propelled vehicles4%
PatentTitleYear
12,249,494Remote plasma cleaning of chambers for electronics manufacturing systems202512,015,940Reception apparatus, antenna control method, and communication system202411,932,950Organic contamination free surface machining202411,854,773Remote plasma cleaning of chambers for electronics manufacturing systems202311,555,250Organic contamination free surface machining202311,271,428Energy receiver, detection method, power transmission system, detection device, and energy transmitter2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022Patents assigned to SONY CORP (1)· patent assignee history
2022–2024Based in JP· patent location history
2023–2025Patents assigned to APPLIED MATERIALS INC (4)· patent assignee history
2023–2025Based in US· patent location history
2024Patents assigned to SONY SEMICONDUCTOR SOLUTIONS CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 4 | 2023–2025 |
| SONY CORP | 1 | 2022 |
| SONY SEMICONDUCTOR SOLUTIONS CORP | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 4 | 2023–2025 |
| JP | 2 | 2022–2024 |