Inventor
CHUN-YEN LO
Inventor
TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1026%
C25DProcesses for the electrolytic or electrophoretic production of coatings5%
G06FElectric digital data processing5%
PatentTitleYear
12,406,970Semiconductor package and method of bonding workpieces202512,381,191Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package202512,087,618Method for forming semiconductor die having edge with multiple gradients202411,908,843Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package202411,527,504Conductive external connector structure and method of forming202211,211,318Bump layout for coplanarity improvement2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (6)· patent assignee history
2021–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 6 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 6 | 2021–2025 |