LexDanaLexDanabeta
Inventor

Steven Webster

Inventor
Chandler, AZ, US

Overview

123→
Patents
2001–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 123 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation16%
H04NPictorial communication, e.g. television12%
G02BOptical elements, systems or apparatus9%
Y10TTechnical subjects covered by former us classification7%
H05KPrinted circuits4%
G06KGraphical data reading3%
G06VImage or video recognition or understanding3%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them3%
G06FElectric digital data processing3%
PatentTitleYear
10,969,652Camera with folded optics having moveable lens202110,783,347Capacitive sensor packaging202010,779,403Shorting pattern between pads of a camera module202010,712,581Mirror tilt actuation202010,429,666Camera actuator with magnet holder having magnetic field201910,423,815Capacitive sensor packaging201910,373,992Compact camera module201910,298,820Camera module with embedded components201910,171,713Method of aligning lens optical axis to image sensor plane without active alignment201910,162,191Mirror tilt actuation201810,090,358Camera module in a unibody circuit carrier with component embedding201810,007,833Capacitive sensor packaging201810,007,832Capacitive sensor packaging20189,869,881'Passive damping solution to optical image stabilization for voice control motors'20189,735,191'Molded semiconductor package'20179,632,327'Mirror tilt actuation'20179,576,178'Capacitive sensor packaging'20179,465,221'Digital camera with light splitter'20169,332,164'Molded semiconductor package with snap lid'20169,285,566'Mirror tilt actuation'20169,268,989'Capacitive sensor packaging'20169,210,306'Method and system for a single frame camera module active alignment tilt correction'20159,135,495'Capacitive sensor packaging'20159,060,111'Electronic device with compact camera module'20159,030,440'Capacitive sensor packaging'20159,001,081'Capacitive sensor packaging'20158,994,860'Molded image sensor package and method'20158,988,564'Digital camera with light splitter'20158,902,352'Lens barrel mechanical interference prevention measures for camera module voice coil motor design'20148,605,211'Low rise camera module'20137,786,429'Camera module with window mechanical attachment'20107,729,606'Lens module and digital camera module using same'20107,696,619'Stack combination of plural chip package units'20107,646,429'Digital camera module packaging method'20107,643,081'Digital camera module with small sized image sensor chip package'20107,609,461'Optical module having cavity substrate'20097,595,839'Image sensor chip packaging method'20097,592,197'Image sensor chip package fabrication method'20097,554,184'Image sensor chip package'20097,540,672'Digital still camera module'20097,538,862'Testing system for digital camera modules'20097,460,317'Digital camera module with improved image quality'20087,425,750'Snap lid camera module'20087,417,327'IC chip package with cover'20087,408,205'Digital camera module'20087,365,421'IC chip package with isolated vias'20087,361,880'Digital camera module for detachably mounting with flex printed circuit board'20087,342,215'Digital camera module package fabrication method'20087,332,712'Camera module fabrication method including the step of removing a lens mount and window from the mold'20087,199,359'Camera module fabrication method including singulating a substrate'20077,126,111'Camera module having a threaded lens barrel and a ball grid array connecting device'20067,059,040'Optical module with lens integral holder fabrication method'20066,967,395'Mounting for a package containing a chip'20056,956,201'Image sensor package fabrication method'20056,946,316'Method of fabricating and using an image sensor package'20056,943,429'Wafer having alignment marks extending from a first to a second surface of the wafer'20056,875,379'Tool and method for forming an integrated optical circuit'20056,869,861'Back-side wafer singulation method'20056,849,916'Flip chip on glass sensor package'20056,816,523'VCSEL package and fabrication method'20046,791,076'Image sensor package'20046,784,534'Thin integrated circuit package having an optically transparent window'20046,777,789'Mounting for a package containing a chip'20046,734,419'Method for forming an image sensor package with vision die in lens housing'20046,730,536'Pre-drilled image sensor package fabrication method'20046,717,126'Method of fabricating and using an image sensor package with reflector'20046,686,580'Image sensor package with reflector'20046,686,588'Optical module with lens integral holder'20046,672,773'Optical fiber having tapered end and optical connector with reciprocal opening'20046,670,698'Integrated circuit package mounting'20036,661,080'Structure for backside saw cavity protection'20036,638,789'Micromachine stacked wirebonded package fabrication method'20036,629,633'Chip size image sensor bumped package fabrication method'20036,627,987'Ceramic semiconductor package and method for fabricating the package'20036,627,864'Thin image sensor package'20036,624,921'Micromirror device package fabrication method'20036,620,646'Chip size image sensor wirebond package fabrication method'20036,610,167'Method for fabricating a special-purpose die using a polymerizable tape'20036,586,826'Integrated circuit package having posts for connection to other packages and substrates'20036,586,824'Reduced thickness packaged electronic device'20036,580,167'Heat spreader with spring IC package'20036,580,153'Structure for protecting a micromachine with a cavity in a UV tape'20036,577,013'Chip size semiconductor packages with stacked dies'20036,571,466'Flip chip image sensor package fabrication method'20036,572,944'Structure for fabricating a special-purpose die using a polymerizable tape'20036,564,454'Method of making and stacking a semiconductor package'20036,562,655'Heat spreader with spring IC package fabrication method'20036,548,759'Pre-drilled image sensor package'20036,545,345'Mounting for a package containing a chip'20036,530,515'Micromachine stacked flip chip package fabrication method'20036,532,157'Angulated semiconductor packages'20036,526,653'Method of assembling a snap lid image sensor package'20036,528,875'Vacuum sealed package for semiconductor chip'20036,528,857'Chip size image sensor bumped package'20036,522,015'Micromachine stacked wirebonded package'20036,515,269'Integrally connected image sensor packages having a window support in contact with a window and the active area'20036,512,219'Fabrication method for integrally connected image sensor packages having a window support in contact with the window and active area'20036,509,560'Chip size image sensor in wirebond package with step-up ring for electrical contact'20036,503,780'Wafer scale image sensor package fabrication method'20036,492,699'Image sensor package having sealed cavity over active area'20026,486,545'Pre-drilled ball grid array package'20026,483,101'Molded image sensor package having lens holder'20026,483,030'Snap lid image sensor package'20026,455,927'Micromirror device package'20026,455,774'Molded image sensor package'20026,448,506'Semiconductor package and circuit board for making the package'20026,441,504'Precision aligned and marked structure'20026,441,503'Bond wire pressure sensor die package'20026,432,737'Method for forming a flip chip pressure sensor die package'20026,429,513'Active heat sink for cooling a semiconductor chip'20026,424,315'Semiconductor chip having a radio-frequency identification transceiver'20026,420,776'Structure including electronic components singulated using laser cutting'20026,420,201'Method for forming a bond wire pressure sensor die package'20026,407,381'Wafer scale image sensor package'20026,406,934'Wafer level production of chip size semiconductor packages'20026,399,418'Method for forming a reduced thickness packaged electronic device'20026,399,463'Method of singulation using laser cutting'20026,396,043'Thin image sensor package fabrication method'20026,389,687'Method of fabricating image sensor packages in an array'20026,342,406'Flip chip on glass image sensor package fabrication method'20026,309,943'Precision marking and singulation method'20016,266,197'Molded window array for image sensor packages'20016,243,249'Lightning strike protection circuit board assembly'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2017Patents assigned to AMKOR TECHNOLOGY INC (80)· patent assignee history
2001–2017Based in Chandler, AZ, US· patent location history
2002–2004Based in Muntinlupa, PH· patent location history
2002–2005Based in Manila, PH· patent location history
2008–2010Patents assigned to ALTUS TECHNOLOGY INC (13)· patent assignee history
2008–2010Based in Miaoli, TW· patent location history
2010Patents assigned to HON HAI PREC IND CO LTD (2)· patent assignee history
2013–2021Patents assigned to APPLE INC (27)· patent assignee history
2013–2015Patents assigned to WEBSTER STEVEN (4)· patent assignee history
2013–2020Based in Palo Alto, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
AMKOR TECHNOLOGY INC802001–2017
APPLE INC272013–2021
ALTUS TECHNOLOGY INC132008–2010
WEBSTER STEVENself42013–2015
HON HAI PREC IND CO LTD22010
Locations
LocationPatentsSpan
Chandler, AZ, US572001–2017
Palo Alto, California, US142013–2020
Muntinlupa, PH132002–2004
Miaoli, TW112008–2010
Manila, PH82002–2005