Inventor
Woon-bae Kim
Inventor
Suwon-si, KR
Overview
Patents· 78 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G02Bprimary
G02BOptical elements, systems or apparatus14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
A61BDiagnosis6%
B81BMicrostructural devices or systems, e.g. micromechanical devices6%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems6%
H04NPictorial communication, e.g. television5%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation5%
H10DInorganic electric semiconductor devices4%
Y10TTechnical subjects covered by former us classification4%
H01LSemiconductor devices3%
PatentTitleYear
10,867,948Metal pillar in a film-type seconductor package202010,349,835Optical switching unit, optical probe including the same, and medical imaging apparatus including optical probe201910,354,967Metal pillar in a film-type semiconductor package201910,251,559Laser-induced ultrasonic wave apparatus and method201910,134,667Chip-on-film semiconductor packages and display apparatus including the same201810,105,102Package for processing sensed-data, sensed-data processor, and system for processing sensed-data201810,078,160Variable liquid lens system20189,978,674Chip-on-film semiconductor packages and display apparatus including the same20189,880,381'Varifocal lens, optical scanning probe including the varifocal lens, and medical apparatus including the optical scanning probe'20189,870,100'Multi-touch sensing apparatus using rear view camera of array type'20189,837,361Semiconductor package with electromagnetic shielding member20179,717,476'Probe and medical imaging apparatus including the same'20179,664,894'Micro optical switch device, image display apparatus including the same, and method of manufacturing the micro optical switch device'20179,638,839'Optical zoom probe'20179,629,552'Numerical aperture (NA) controlling unit, variable optical probe including the NA controlling unit, and depth scanning method using the NA controlling unit'20179,529,241'Microfluidic device and method of controlling fluid in the same'20169,459,138'Ultrasonic transducer, and ultrasonic wave generating apparatus and ultrasonic system including the same'20169,445,063'Fiber scanning projector'20169,405,045'Optical apparatus'20169,164,278'Micro-optical switching device, image display apparatus including micro-optical switching device, and method of manufacturing micro-optical switching device'20159,151,945'Micro electric liquid device and apparatus including the same'20159,110,318'Driving device of display apparatus and method of manufacturing the driving device'20159,098,146'Multi-touch sensing apparatus using rear view camera of array type'20158,797,653'Device and method for controlling curvature of lens surface'20148,654,177'Flexible image photographing apparatus with a plurality of image forming units and method for manufacturing the same'20148,587,561'Multi-sensing touch panel and display apparatus using the same'20138,531,580'Imaging device including a plurality of imaging units'20138,508,824'Scanning lens apparatus adopting bimorph actuator'20138,482,860'Varifocal lens structure and method of manufacturing the same'20138,411,366'Optical probe and optical system therefor'20138,313,197'Pattern projecting apparatus, three dimensional imaging apparatus having the same, and varifocal liquid lens being used in the same'20128,305,699'Wafer-level lens module with extended depth of field and imaging device including the wafer-level lens module'20128,300,317'Varifocal lens'20128,173,949'Image sensing apparatus with artificial ommatidia and manufacturing method for artificial ommatidia unit'20128,147,150'Micro shutter having iris function, method for manufacturing the same, and micro camera module having the same'20128,149,512'Micro-shutter device and method of manufacturing the same'20128,111,464'Optical lens and manufacturing method thereof'20128,061,910'Micro shutter having iris function, method for manufacturing the same, and micro camera module having the same'20118,045,318'Tunable capacitor using electrowetting phenomenon'20117,986,466'Varifocal lens'20117,963,021'Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package'20117,923,793'Image sensor module and fabrication method thereof'20117,906,841'Wafer level incapsulation chip and encapsulation chip manufacturing method'20117,794,799'Process for producing array plate for biomolecules having hydrophilic and hydrophobic regions'20107,786,573'Packaging chip having interconnection electrodes directly connected to plural wafers'20107,755,151'Wafer level package for surface acoustic wave device and fabrication method thereof'20107,719,167'Electroactive polymer actuator and manufacturing method thereof'20107,667,946'Tunable capacitor using electrowetting phenomenon'20107,663,083'Image sensor module having electric component and fabrication method thereof'20107,626,258'Cap wafer, semiconductor chip having the same, and fabrication method thereof'20097,619,837'Varifocal optical device'20097,616,356'Image sensor and method of manufacturing thereof'20097,615,397'Micro-element package and manufacturing method thereof'20097,605,404'Image pickup device and method of manufacturing the same'20097,589,422'Micro-element package having a dual-thickness substrate and manufacturing method thereof'20097,580,195'Optical lens and method of manufacturing the same'20097,579,685'Wafer level packaging cap and fabrication method thereof'20097,545,017'Wafer level package for surface acoustic wave device and fabrication method thereof'20097,528,481'Wafer level packaging cap and fabrication method thereof'20097,456,709'Bulk acoustic resonator including a resonance part with dimple and fabrication method therefor'20087,452,809'Fabrication method of packaging substrate and packaging method using the packaging substrate'20087,449,366'Wafer level packaging cap and fabrication method thereof'20087,442,622'Silicon direct bonding method'20087,417,525'High efficiency inductor, method for manufacturing the inductor, and packaging structure using the inductor'20087,408,434'Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package'20087,408,257'Packaging chip and packaging method thereof'20087,374,972'Micro-package, multi-stack micro-package, and manufacturing method therefor'20087,335,974'Multi stack packaging chip and method of manufacturing the same'20087,285,865'Micro-package, multi-stack micro-package, and manufacturing method therefor'20077,065,867'Low temperature hermetic sealing method having passivation layer'20067,008,817'Method for manufacturing micro electro-mechanical systems using solder balls'20066,969,639'Wafer level hermetic sealing method'20056,906,845'Micro-mechanical device having anti-stiction layer and method of manufacturing the device'20056,633,513'Magneto-optical head for magneto-optical reading and writing system'20036,111,721'Tray loading type magnetic recording and reproducing apparatus for different size tape cassettes'20006,061,203'Device for opening lids of varying sized tape cassettes in a magnetic recording and reproducing apparatus'20005,754,360'Magnetic recording/reproducing apparatus'19985,372,326'Reel driving apparatus for tape recorder'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (74)· patent assignee history
1994–2020Based in Seoul, KR· patent location history
1998–2018Based in Suwon-si, KR· patent location history
2000Based in Kyonggi-do, KR· patent location history
2005–2008Based in Gyeonggi-do, KR· patent location history
2008–2017Patents assigned to KIM WOON-BAE (19)· patent assignee history
2009–2017Based in Yongin-si, KR· patent location history
2011–2017Patents assigned to JUNG KYU-DONG (9)· patent assignee history
2012–2017Patents assigned to LEE SEUNG-WAN (12)· patent assignee history
2012–2017Patents assigned to CHOI MIN-SEOG (7)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 74 | 1994–2020 |
| KIM WOON-BAEself | 19 | 2008–2017 |
| LEE SEUNG-WAN | 12 | 2012–2017 |
| JUNG KYU-DONG | 9 | 2011–2017 |
| CHOI MIN-SEOG | 7 | 2012–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Suwon-si, KR | 42 | 1998–2018 |
| Seoul, KR | 27 | 1994–2020 |
| Yongin-si, KR | 5 | 2009–2017 |
| Gyeonggi-do, KR | 2 | 2005–2008 |
| Kyonggi-do, KR | 2 | 2000 |