Inventor
Shintaro Nanbara
Inventor
Mie, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Fprimary
H01FMagnets44%
B22FWorking metallic powder11%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds11%
C09JAdhesives11%
C22CAlloys11%
H05KPrinted circuits11%
PatentTitleYear
10,892,081Reactor202110,825,591Composite material molded article and reactor202010,770,209Soft magnetic powder, magnetic core, method for manufacturing soft magnetic powder, and method for manufacturing magnetic core202010,147,536Reactor20189,133,300'Resin composition for adhesive, adhesive containing resin composition for adhesive, adhesive sheet containing resin composition for adhesive, and printed wiring board including adhesive or adhesive sheet as adhesive layer'2015Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015Patents assigned to ASADA HIROKO (1)· patent assignee history
2015Patents assigned to ITO TAKESHI (1)· patent assignee history
2015Based in Otsu, JP· patent location history
2018–2021Patents assigned to AUTONETWORKS TECHNOLOGIES LTD (4)· patent assignee history
2018–2021Patents assigned to SUMITOMO ELECTRIC INDUSTRIES (4)· patent assignee history
2018–2021Patents assigned to SUMITOMO WIRING SYSTEMS (4)· patent assignee history
2018–2021Based in Mie, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AUTONETWORKS TECHNOLOGIES LTD | 4 | 2018–2021 |
| SUMITOMO ELECTRIC INDUSTRIES | 4 | 2018–2021 |
| SUMITOMO WIRING SYSTEMS | 4 | 2018–2021 |
| ASADA HIROKO | 1 | 2015 |
| ITO TAKESHI | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Mie, JP | 4 | 2018–2021 |
| Otsu, JP | 1 | 2015 |