Inventor
Sebastiano Conti
Inventor
Pregnana Milanese, IT
Overview
Patents· 36 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices20%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers18%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems11%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
G02BOptical elements, systems or apparatus6%
H01LSemiconductor devices5%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them4%
H04NPictorial communication, e.g. television4%
Y10TTechnical subjects covered by former us classification4%
PatentTitleYear
10,962,431Pressure sensor generating a transduced signal with reduced ambient temperature dependence, and manufacturing method thereof202110,809,140Pressure sensor generating a transduced signal with reduced ambient temperature dependence, and manufacturing method thereof202010,725,286Micro-electro-mechanical device having tiltable structure, with detection of the position of the tiltable structure202010,549,982Pressure sensor encapsulated in elastomeric material, and system including the pressure sensor202010,484,798Acoustic transducer and microphone using the acoustic transducer201910,427,933Microelectromechanical sensor device with reduced stress-sensitivity and corresponding manufacturing process201910,433,068MEMS acoustic transducer with combfingered electrodes and corresponding manufacturing process201910,405,107Acoustic transducer201910,365,475Oscillating structure with piezoelectric actuation, system and manufacturing method201910,356,531Piezoelectric MEMS sensor, such as force, pressure, deformation sensor or microphone, with improved sensitivity201910,288,874Mirror micromechanical structure and related manufacturing process201910,257,617Acoustic transducer201910,239,748Microelectromechanical device with protection for bonding201910,101,578Micro-electro-mechanical device having a tiltable structure, with detection of the position of the tiltable structure201810,024,738Capacitive micro-electro-mechanical force sensor and corresponding force sensing method20189,975,756Micro-electro-mechanical pressure device and methods of forming same20189,961,451Differential-type MEMS acoustic transducer20189,936,305Acoustic transducer and microphone using the acoustic transducer20189,914,639'Microelectromechanical sensor device with reduced stress-sensitivity and corresponding manufacturing process'20189,843,868'Acoustic transducer'20179,835,850Mirror micromechanical structure and related manufacturing process20179,670,056'Electrostatically driven MEMS device'20179,628,919'Wafer level assembly of a MEMS sensor device and related MEMS sensor device'20179,540,229'Packaged sensor assembly'20179,544,573'Mirror micromechanical structure and related manufacturing process'20179,380,380'Acoustic transducer and interface circuit'20169,363,608'Acoustic transducer'20169,332,354'Micromechanical detection structure for a MEMS acoustic transducer and corresponding manufacturing process'20169,226,079'Microelectromechanical sensing structure for a capacitive acoustic transducer including an element limiting the oscillations of a membrane, and manufacturing method thereof'20159,096,424'Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof'20158,952,468'Acoustic sensor, acoustic transducer, microphone using the acoustic transducer, and method for manufacturing the acoustic transducer'20158,942,394'Integrated acoustic transducer obtained using MEMS technology, and corresponding manufacturing process'20158,861,753'Acoustic transducer, and microphone using the acoustic transducer'20148,836,111'Semiconductor integrated device assembly and related manufacturing process'20148,787,600'Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof'20148,433,084'Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof'2013Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2013–2021Patents assigned to ST MICROELECTRONICS SRL (35)· patent assignee history
2013–2018Patents assigned to CONTI SEBASTIANO (5)· patent assignee history
2013–2019Based in Mistretta, IT· patent location history
2014–2019Patents assigned to OMRON TATEISI ELECTRONICS CO (8)· patent assignee history
2014–2018Patents assigned to KASAI TAKASHI (2)· patent assignee history
2014–2018Patents assigned to UCHIDA YUKI (2)· patent assignee history
2014–2015Based in Messina, IT· patent location history
2017–2021Based in Pregnana Milanese, IT· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ST MICROELECTRONICS SRL | 35 | 2013–2021 |
| OMRON TATEISI ELECTRONICS CO | 8 | 2014–2019 |
| CONTI SEBASTIANOself | 5 | 2013–2018 |
| KASAI TAKASHI | 2 | 2014–2018 |
| UCHIDA YUKI | 2 | 2014–2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Pregnana Milanese, IT | 17 | 2017–2021 |
| Mistretta, IT | 17 | 2013–2019 |
| Messina, IT | 2 | 2014–2015 |