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Inventor

Minhua Lu

Inventor
Mohegan Lake, NY, US

Overview

73→
Patents
1996–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 73 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G02Fprimary
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
Y10TTechnical subjects covered by former us classification8%
H01LSemiconductor devices7%
H05KPrinted circuits5%
G02BOptical elements, systems or apparatus4%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact3%
H10DInorganic electric semiconductor devices3%
C09KMaterials for miscellaneous applications, not provided for elsewhere3%
G01NInvestigating or analysing materials by determining their chemical or physical properties3%
PatentTitleYear
10,687,425Method of forming a plurality of electro-optical module assemblies202010,670,656Integrated electro-optical module assembly202010,653,349Diagnostic apparatus202010,638,613Method of forming a plurality of electro-optical module assemblies202010,621,885Wearable sensor monitoring and data analysis202010,605,741Accurate colorimetric based test strip reader system202010,545,116Nano dipole sensors202010,393,798Integrated electro-optical module assembly201910,393,667Analysis using optical sensors and signal enhancing agents201910,258,142Toothbrush with sensors201910,229,288Enhanced data security platform201910,108,068Liquid crystal lens with variable focal length201810,101,631Liquid crystal lens with variable focal length20189,820,395'Low cost hermetic micro-electronics'20179,721,864'Low cost hermetic micro-electronics'20179,379,007'Electromigration-resistant lead-free solder interconnect structures'20169,318,414'Integrated circuit structure with through-semiconductor via'20169,318,413'Integrated circuit structure with metal cap and methods of fabrication'20169,305,866'Intermetallic compound filled vias'20169,299,847'Printed transistor and fabrication method'20169,281,621'HDMI interface having a cable and a connector with a plurality of terminals and wiring ends arranged in parallel and in a row'20169,142,501'Under ball metallurgy (UBM) for improved electromigration'20159,087,753'Printed transistor and fabrication method'20159,082,762'Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip'20159,084,378'Under ball metallurgy (UBM) for improved electromigration'20159,057,915'Liquid crystal integrated circuit and method to fabricate same'20158,541,854'Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure'20138,518,741'Wafer-to-wafer process for manufacturing a stacked structure'20138,450,849'Robust FBEOL and UBM structure of C4 interconnects'20138,227,918'Robust FBEOL and UBM structure of C4 interconnects'20128,197,612'Optimization of metallurgical properties of a solder joint'20128,163,584'Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure'20128,110,746'Cooling of substrate using interposer channels'20128,081,280'Method of producing UV stable liquid crystal alignment'20118,059,400'Cooling of substrate using interposer channels'20118,018,560'Method and system for improving ion beam alignment for liquid crystal displays by forming an alignment layer over grooved surface profile'20117,888,603'Cooling of substrate using interposer channels'20117,856,711'Method of forming a substrate with interposer channels for cooling the substrate'20107,658,865'Conducting liquid crystal polymer matrix comprising carbon nanotubes, use thereof and method of fabrication'20107,570,333'Method and system for improving ion beam alignment for liquid crystal displays by a grooving under layer'20097,434,308'Cooling of substrate using interposer channels'20087,316,831'Tilted vertical alignment of liquid crystals employing inorganic thin film composition and ion beam treatment'20087,316,789'Conducting liquid crystal polymer nature comprising carbon nanotubes, use thereof and method of fabrication'20087,180,179'Thermal interposer for thermal management of semiconductor devices'20077,124,636'Non-contact measurement of material property'20067,097,884'Stability of ion beam generated alignment layers by surface modification'20067,061,559'Stacked color liquid crystal display device'20067,057,686'Liquid crystal structure with improved black state, and projector using same'20067,002,247'Thermal interposer for thermal management of semiconductor devices'20066,995,821'Methods of reducing unbalanced DC voltage between two electrodes of reflective liquid crystal display by thin film passivation'20066,954,247'Multi-domain low twist angle liquid crystal cells and methods of production thereof'20056,798,475'Reflective light valve'20046,731,361'High resolution in-plane switching mode TFT-LCD'20046,665,033'Method for forming alignment layer by ion beam surface modification'20036,660,341'Tilted vertical alignment of liquid crystals employing inorganic thin film composition and ion beam treatment'20036,654,080'Stacked color liquid crystal display device'20036,654,089'Maskless method and system for creating a dual-domain pattern on a diamond-like carbon alignment layer'20036,650,383'Band-shifted liquid crystal structure for projection of images without spectral distortion'20036,632,483'Ion gun deposition and alignment for liquid-crystal applications'20036,593,586'Method and apparatus for making a crystal alignment layer'20036,426,786'Method of homeotropic alignment or tilted homeotropic alignment of liquid crystals by single oblique evaporation of oxides and liquid crystal display device formed thereby'20026,377,321'Stacked color liquid crystal display device'20026,331,381'Method for making a liquid crystal alignment layer'20016,290,793'Stress-free liquid crystal cell assembly'20016,181,400'Discotic-type twist-film compensated single-domain or two-domain twisted nematic liquid crystal displays'20016,126,768'Stress-free liquid crystal cell assembly'20005,883,687'Polarization independent liquid crystal phase gratings for reflective spatial light modulators'19995,870,164'Polarization dependent twisted nematic liquid crystal devices for reflective spatial light modulators'19995,831,710'Liquid crystal display'19985,764,324'Flicker-free reflective liquid crystal cell'19985,644,330'Driving method for polymer stabilized and polymer free liquid crystal displays'19975,570,216'Bistable cholesteric liquid crystal displays with very high contrast and excellent mechanical stability'19965,493,430'Color, reflective liquid crystal displays'1996

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1996–1997Based in Kent, OH, US· patent location history
1997–2006Patents assigned to KENT DISPLAYS INC (4)· patent assignee history
1998–2020Patents assigned to IBM (60)· patent assignee history
1998–2020Based in Mohegan Lake, NY, US· patent location history
2011–2016Patents assigned to LU MINHUA (12)· patent assignee history
2012–2013Patents assigned to COTTE JOHN M (2)· patent assignee history
2013–2016Based in Yorktown Heights, NY, US· patent location history
2013–2015Based in Armonk, NY, US· patent location history
2016Patents assigned to GLOBALFOUNDRIES INC (4)· patent assignee history
2016Based in Guangdong, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM601998–2020
LU MINHUAself122011–2016
GLOBALFOUNDRIES INC42016
KENT DISPLAYS INC41997–2006
COTTE JOHN M22012–2013
Locations
LocationPatentsSpan
Mohegan Lake, New York, US621998–2020
Yorktown Heights, New York, US42013–2016
Kent, OH, US31996–1997
Armonk, New York, US22013–2015
Guangdong, CN12016