Inventor
Marcus E. Interrante
Inventor
New Paltz, NY, US
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
H01LSemiconductor devices39%
B23KSoldering or unsoldering9%
H05KPrinted circuits4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
PatentTitleYear
10,978,314Multi integrated circuit chip carrier package202110,832,987Managing thermal warpage of a laminate202010,804,181Heterogeneous thermal interface material for corner and or edge degradation mitigation202010,541,156Multi integrated circuit chip carrier package20209,583,408'Reducing directional stress in an orthotropic encapsulation member of an electronic package'20179,401,315'Thermal hot spot cooling for semiconductor devices'20169,293,439'Electronic module assembly with patterned adhesive array'20169,224,712'3D bond and assembly process for severely bowed interposer die'20159,093,563'Electronic module assembly with patterned adhesive array'20158,444,043'Uniform solder reflow fixture'2013Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2013–2021Patents assigned to IBM (8)· patent assignee history
2013Patents assigned to BERNIER WILLIAM E (1)· patent assignee history
2013Patents assigned to INTERRANTE MARCUS E (1)· patent assignee history
2013Patents assigned to KUMAR RAJNEESH (1)· patent assignee history
2013–2017Based in New Paltz, NY, US· patent location history
2016Patents assigned to GLOBALFOUNDRIES INC (2)· patent assignee history
2020–2021Based in Ulster, NY, US· patent location history
2020Based in Highland, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 8 | 2013–2021 |
| GLOBALFOUNDRIES INC | 2 | 2016 |
| BERNIER WILLIAM E | 1 | 2013 |
| INTERRANTE MARCUS Eself | 1 | 2013 |
| KUMAR RAJNEESH | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| New Paltz, New York, US | 6 | 2013–2017 |
| Ulster, New York, US | 2 | 2020–2021 |
| Highland, New York, US | 2 | 2020 |