Inventor
Lixiong Luo
Inventor
San Jose, CA, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1083%
H01LSemiconductor devices17%
PatentTitleYear
9,040,356'Semiconductor including cup-shaped leadframe packaging techniques'20157,595,547'Semiconductor die package including cup-shaped leadframe'20096,909,170'Semiconductor assembly with package using cup-shaped lead-frame'20056,744,124'Semiconductor die package including cup-shaped leadframe'20046,249,041'IC chip package with directly connected leads'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2005Patents assigned to SILICONIX INC (3)· patent assignee history
2001–2015Based in San Jose, CA, US· patent location history
2009–2015Patents assigned to VISHAY SILICONIX (2)· patent assignee history
2015Patents assigned to CHANG MIKE (1)· patent assignee history
2015Patents assigned to CHU WEI-BING (1)· patent assignee history
2015Patents assigned to HO YUEH-SE (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SILICONIX INC | 3 | 2001–2005 |
| VISHAY SILICONIX | 2 | 2009–2015 |
| CHANG MIKE | 1 | 2015 |
| CHU WEI-BING | 1 | 2015 |
| HO YUEH-SE | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 5 | 2001–2015 |