Inventor
Koushik Ramachandran
Inventor
Wappingers Falls, NY, US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G02Bprimary
G02BOptical elements, systems or apparatus38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
G06FElectric digital data processing13%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes13%
H01LSemiconductor devices13%
PatentTitleYear
10,885,590Granting access to a blockchain ledger202110,598,860Photonic die fan out package with edge fiber coupling interface and related methods202010,438,894Chip-to-chip and chip-to-substrate interconnections in multi-chip semiconductor devices201910,409,014PIC die packaging using magnetics to position optical element2019Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2019–2020Patents assigned to GLOBALFOUNDRIES INC (3)· patent assignee history
2019–2020Based in Wappingers Falls, NY, US· patent location history
2019Based in Highland Falls, NY, US· patent location history
2021Patents assigned to IBM (1)· patent assignee history
2021Based in Campbell, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| GLOBALFOUNDRIES INC | 3 | 2019–2020 |
| IBM | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Wappingers Falls, New York, US | 2 | 2019–2020 |
| Campbell, California, US | 1 | 2021 |
| Highland Falls, New York, US | 1 | 2019 |