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Inventor

Jia Tan

Inventor
Beijing, CN

Overview

15→
Patents
2011–2020
Patent span
Physics
Primary field (CPC G)

Patents· 15 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G06Fprimary
G06FElectric digital data processing52%
H04LTransmission of digital information, e.g. telegraphic communication30%
G01RMeasuring electric variables9%
G06NComputing arrangements based on specific computational models9%
PatentTitleYear
10,795,656Deploying an application in a cloud computing environment202010,747,781Determination of data partition202010,649,751Deploying an application in a cloud computing environment202010,528,333Deploying an application in a cloud computing environment202010,228,935Rebuildable service-oriented applications201910,048,957Deploying an application in a cloud computing environment201810,019,504Determination of data partition20189,983,280Local coil20189,785,431'Development, test and deployment of applications'20179,746,534'Adapter, coil, and magnetic resonance imaging system'20179,524,145'Rebuildable service-oriented applications'20169,471,386'Allocating resources to tasks in a build process'20169,361,081'Deploying an application in a cloud computing environment'20169,354,851'Deploying an application in a cloud computing environment'20167,954,107'Method and system for integrating the existing web-based system'2011

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2011–2020Patents assigned to IBM (13)· patent assignee history
2011–2020Based in Beijing, CN· patent location history
2017–2018Patents assigned to SIEMENS AG (2)· patent assignee history
2017–2018Patents assigned to TAN JIA HENG (2)· patent assignee history
2017–2018Patents assigned to TONG TONG (2)· patent assignee history
2017Patents assigned to CHEN YAN HONG (1)· patent assignee history
2017–2018Based in Shenzhen, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM132011–2020
SIEMENS AG22017–2018
TAN JIA HENGself22017–2018
TONG TONG22017–2018
CHEN YAN HONG12017
Locations
LocationPatentsSpan
Beijing, CN132011–2020
Shenzhen, CN22017–2018