Inventor

James Wilson Rose

Inventor

Guilderland, NY, US

Overview

71→

Patents

1979–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 71 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%

H05KPrinted circuits12%

G01TMeasurement of nuclear or x-radiation7%

A61BDiagnosis6%

Y10TTechnical subjects covered by former us classification6%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation5%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%

H01LSemiconductor devices4%

G01NInvestigating or analysing materials by determining their chemical or physical properties2%

H01CResistors2%

PatentTitleYear

10,607,929Electronics package having a self-aligning interconnect assembly and method of making same2020 10,163,773Electronics package having a self-aligning interconnect assembly and method of making same2018 9,960,124Integrated shield structure for mixed-signal integrated circuits2018 9,753,151'Light guide array for pet detector fabrication methods and apparatus'2017 9,689,996'Integrated diode DAS detector'2017 9,603,574'Reconfigurable electronic substrate'2017 9,337,233'Photodiode array for imaging applications'2016 D0723828'Seating bench'2015 8,853,550'Circuit board including mask for controlling flow of solder'2014 8,824,635'Detector modules for imaging systems and methods of manufacturing'2014 8,575,558'Detector array with a through-via interposer'2013 8,492,762'Electrical interface for a sensor array'2013 8,247,778'Scintillator arrays and methods of making the same'2012 8,041,003'Electronic packaging technique to improve sensor failure robustness'2011 7,919,714'System and a method for controlling flow of solder'2011 7,916,836'Method and apparatus for flexibly binning energy discriminating data'2011 7,867,824'Methods of fabricating a large area transducer array'2011 7,606,346'CT detector module construction'2009 7,606,347'Photon counting x-ray detector with overrange logic control'2009 7,586,096'Interface assembly for thermally coupling a data acquisition system to a sensor array'2009 7,564,125'Electronic array and methods for fabricating same'2009 7,517,785'Electronic interconnects and methods of making same'2009 7,518,251'Stacked electronics for sensors'2009 7,450,683'Tileable multi-layer detector'2008 7,402,808'Radiation imaging system and method'2008 7,375,420'Large area transducer array'2008 7,367,217'Sensor device for detection of dissolved hydrocarbon gases in oil filled high-voltage electrical equipment'2008 7,289,336'Electronic packaging and method of making the same'2007 7,254,986'Sensor device for detection of dissolved hydrocarbon gases in oil filled high-voltage electrical equipment'2007 7,130,510'Active optical alignment of laser diode array for drilling precising holes'2006 7,112,877'High density package with wrap around interconnect'2006 7,069,228'Apparatus and method for an internet based computer reservation booking system'2006 6,990,176'Methods and apparatus for tileable sensor array'2006 6,933,813'Interconnection structure with etch stop'2005 6,830,229'Two-stage valve suitable as high-flow high-pressure microvalve'2004 6,819,001'Interposer, interposer package and device assembly employing the same'2004 6,790,703'Apparatus for aligning die to interconnect metal on flex substrate'2004 6,737,002'Fabrication of plastic module with exposed backside contact'2004 6,733,266'System for fabricating anti-scatter x-ray grid'2004 6,686,676'UV reflectors and UV-based light sources having reduced UV radiation leakage incorporating the same'2004 6,671,948'Interconnection method using an etch stop'2004 6,602,739'Method for making multichip module substrates by encapsulating electrical conductors and filling gaps'2003 6,557,820'Two-stage valve suitable as high-flow high-pressure microvalve'2003 6,548,329'Amorphous hydrogenated carbon hermetic structure fabrication method'2003 6,475,877'Method for aligning die to interconnect metal on flex substrate'2002 6,417,062'Method of forming ruthenium oxide films'2002 6,239,482'Integrated circuit package including window frame'2001 6,177,237'High resolution anti-scatter x-ray grid and laser fabrication method'2001 6,150,719'Amorphous hydrogenated carbon hermetic structure and fabrication method'2000 6,040,226'Method for fabricating a thin film inductor'2000 5,897,728'Integrated circuit test structure and test process'1999 5,872,040'Method for fabricating a thin film capacitor'1999 5,849,623'Method of forming thin film resistors on organic surfaces'1998 5,757,072'Structure for protecting air bridges on semiconductor chips from damage'1998 5,683,928'Method for fabricating a thin film resistor'1997 5,675,310'Thin film resistors on organic surfaces'1997 5,583,821'Storage cell using low powered/low threshold CMOS pass transistors having reduced charge leakage'1996 5,561,085'Structure for protecting air bridges on semiconductor chips from damage'1996 5,471,421'Storage cell using low powered/low threshold CMOS pass transistors having reduced charge leakage'1995 5,338,975'High density interconnect structure including a spacer structure and a gap'1994 5,270,371'Adhesive compositions for electronic packages'1993 5,230,965'High density interconnect with electroplated conductors'1993 5,182,188'Method of developing a self-developing resist'1993 5,178,976'Technique for preparing a photo-mask for imaging three-dimensional objects'1993 5,157,589'Mutliple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing T.sub.G \' s'1992 5,141,829'Method of preparing a photo-mask for imaging three-dimensional objects'1992 5,127,998'Area-selective metallization process'1992 5,008,049'Method for sealing an electronic device containing a fluid material'1991 4,988,412'Selective electrolytic desposition on conductive and non-conductive substrates'1991 4,570,957'Mechanic\'s creeper'1986 4,135,571'Thermal storage systems'1979

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1991–2020Patents assigned to GEN ELECTRIC (57)· patent assignee history

1991–1999Based in Delmar, NY, US· patent location history

1993–2020Based in Guilderland, NY, US· patent location history

1995–2006Based in San Carlos, CA, US· patent location history

1996–1998Patents assigned to MARTIN MARIETTA CORP (2)· patent assignee history

1999–2006Patents assigned to LOCKHEED CORP (6)· patent assignee history

2011–2017Based in Niskayuna, NY, US· patent location history

2012–2014Patents assigned to ROSE JAMES WILSON (4)· patent assignee history

2013–2014Patents assigned to DUROCHER KEVIN MATTHEW (3)· patent assignee history

2015Based in Ridgewood, NJ, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
GEN ELECTRIC	57	1991–2020
LOCKHEED CORP	6	1999–2006
ROSE JAMES WILSONself	4	2012–2014
DUROCHER KEVIN MATTHEW	3	2013–2014
MARTIN MARIETTA CORP	2	1996–1998

Locations

Location	Patents	Span
Guilderland, New York, US	53	1993–2020
Delmar, New York, US	9	1991–1999
San Carlos, California, US	3	1995–2006
Niskayuna, New York, US	2	2011–2017
Ridgewood, New Jersey, US	1	2015