Inventor
James G. McMullen
Inventor
Pattersonville, NY, US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
B23KSoldering or unsoldering10%
B26FPerforating10%
B29CShaping or joining of plastics10%
H05KPrinted circuits10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests10%
PatentTitleYear
5,304,847'Direct thermocompression bonding for thin electronic power chips'19945,206,186'Method for forming semiconductor electrical contacts using metal foil and thermocompression bonding'19935,184,206'Direct thermocompression bonding for thin electronic power chips'19934,764,485'Method for producing via holes in polymer dielectrics'1988Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1988–1994Patents assigned to GEN ELECTRIC (4)· patent assignee history
1988–1994Based in Pattersonville, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| GEN ELECTRIC | 4 | 1988–1994 |
Locations
| Location | Patents | Span |
|---|---|---|
| Pattersonville, New York, US | 4 | 1988–1994 |