Inventor

Hsun-Chung Kuang

Inventor

Hsinchu, TW

Overview

22→

Patents

2011–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 22 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices29%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%

H10DInorganic electric semiconductor devices7%

H10NElectric solid-state devices not otherwise provided for7%

B24BMachines, devices, or processes for grinding or polishing6%

H10BElectronic memory devices4%

B23KSoldering or unsoldering1%

C25FProcesses for the electrolytic removal of materials from objects1%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation1%

PatentTitleYear

11,049,767Semiconductor device and methods of manufacturing thereof2021 10,879,077Planarization apparatus and planarization method thereof2020 10,857,651Apparatus of chemical mechanical polishing and operating method thereof2020 10,790,1893D integrated circuit and methods of forming the same2020 10,727,077Structure and method to expose memory cells with different sizes2020 10,665,449Integrate rinse module in hybrid bonding platform2020 10,529,913Techniques for MRAM MTJ top electrode connection2020 10,510,563Wafer carrier assembly2019 10,350,726Chemical mechanical polishing system and method2019 10,304,903Semiconductor structure2019 10,181,441Through via structure and manufacturing method thereof2019 10,163,651Structure and method to expose memory cells with different sizes2018 10,128,209Wafer bonding process and structure2018 10,090,1963D integrated circuit and methods of forming the same2018 9,893,120'Semiconductor structure and method of forming the same'2018 9,786,628'Air trench in packages incorporating hybrid bonding'2017 9,502,396'Air trench in packages incorporating hybrid bonding'2016 9,425,155'Wafer bonding process and structure'2016 9,257,399'3D integrated circuit and methods of forming the same'2016 8,810,048'3D IC and 3D CIS structure'2014 8,334,187'Hard mask for thin film resistor manufacture'2012 8,080,461'Method of making a thin film resistor'2011

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2011–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (4)· patent assignee history

2011–2012Patents assigned to CHAO CHIH-PING (2)· patent assignee history

2011–2012Patents assigned to KUANG HSUN-CHUNG (2)· patent assignee history

2011–2012Patents assigned to LIU MING CHYI (2)· patent assignee history

2011–2012Based in Yangmei Taoyuan, TW· patent location history

2014–2021Based in Hsinchu, TW· patent location history

2016–2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (18)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	18	2016–2021
TAIWAN SEMICONDUCTOR MFG	4	2011–2016
CHAO CHIH-PING	2	2011–2012
KUANG HSUN-CHUNGself	2	2011–2012
LIU MING CHYI	2	2011–2012

Locations

Location	Patents	Span
Hsinchu, TW	20	2014–2021
Yangmei Taoyuan, TW	2	2011–2012