Inventor
Howard L. Heck
Inventor
Hillsboro, OR, US
Overview
Patents· 37 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing16%
H05KPrinted circuits14%
H01RElectrically-conductive connections12%
Y10TTechnical subjects covered by former us classification8%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use6%
H01PWaveguides4%
H04LTransmission of digital information, e.g. telegraphic communication4%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications4%
H01LSemiconductor devices3%
H04BTransmission3%
PatentTitleYear
11,061,492Gyratory sensing system to enhance wearable device user experience via HMI extension202110,926,788Method for producing a toothed rack for a motor vehicle202110,734,333Semiconductor package having inductive lateral interconnects202010,386,941Gyratory sensing system to enhance wearable device user experience via HMI extension201910,372,527Method of encoding data201910,158,339Capacitive compensation structures using partially meshed ground planes201810,108,227Techniques for providing an interface component for a wearable device201810,089,270Interchangeable power and signal contacts for IO connectors201810,079,158Vertical trench routing in a substrate20189,875,210Method and apparatus of USB 3.1 retimer presence detect and index20189,804,646'Host controlled IO power management'20179,800,001'Rate scalable connector for high bandwidth consumer applications'20179,791,905'Rate scalable IO interface with zero stand-by power and fast start-up'20179,654,342'Bandwidth configurable IO connector'20179,559,905'Type-C retimer state machine and a protocol for inband control and configuration'20179,552,995'Electrical interconnect for an electronic package'20179,525,441'Common mode noise introduction to reduce radio frequency interference'20169,489,333'Adaptive termination scheme for low power high speed bus'20169,391,378'High bandwidth connector for internal and external IO interfaces'20169,362,684'Rate scalable connector for high bandwidth consumer applications'20169,326,380'Universal serial bus hybrid footprint design'20169,312,908'Universal IO connector and interface capable of both wired and wireless operation'20169,223,385'Re-driver power management'20159,215,113'Link training in a communication port'20159,106,217'Width scalable connector for high bandwidth IO interfaces'20158,732,942'Method of forming a high speed interconnect'20147,977,581'Shifted segment layout for differential signal traces to mitigate bundle weave effect'20117,800,459'Ultra-high bandwidth interconnect for data transmission'20107,723,618'Shifted segment layout for differential signal traces to mitigate bundle weave effect'20107,427,719'Shifted segment layout for differential signal traces to mitigate bundle weave effect'20087,271,680'Method, apparatus, and system for parallel plate mode radial pattern signaling'20076,672,902'Reducing electromagnetic interference (EMI) emissions'20045,620,782'Method of fabricating a flex laminate package'19975,509,196'Method of fabricating a flex laminate package'19965,384,690'Flex laminate package for a parallel processor'19955,347,710'Parallel processor and method of fabrication'19945,301,118'Monte carlo simulation design methodology'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994Based in Endicott, NY, US· patent location history
1995–1997Based in Endcott, NY, US· patent location history
2004–2021Patents assigned to INTEL CORP (31)· patent assignee history
2004–2021Based in Hillsboro, OR, US· patent location history
2015–2018Patents assigned to HECK HOWARD L (7)· patent assignee history
2015–2018Patents assigned to JAUSSI JAMES E (7)· patent assignee history
2015–2018Patents assigned to MOONEY STEPHEN R (7)· patent assignee history
2016–2018Patents assigned to CASPER BRYAN K (6)· patent assignee history
2020Based in Beaverton, OR, US· patent location history
2021Based in Dusseldorf, DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 31 | 2004–2021 |
| HECK HOWARD Lself | 7 | 2015–2018 |
| JAUSSI JAMES E | 7 | 2015–2018 |
| MOONEY STEPHEN R | 7 | 2015–2018 |
| CASPER BRYAN K | 6 | 2016–2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hillsboro, OR, US | 30 | 2004–2021 |
| Endcott, New York, US | 3 | 1995–1997 |
| Endicott, New York, US | 2 | 1994 |
| Dusseldorf, DE | 1 | 2021 |
| Beaverton, OR, US | 1 | 2020 |