Inventor
Hao Wang
Inventor
Shanghai, CN
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Rprimary
H01RElectrically-conductive connections21%
H05KPrinted circuits14%
Y10TTechnical subjects covered by former us classification12%
H05BElectric heating7%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications7%
B23BTurning5%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling5%
B24BMachines, devices, or processes for grinding or polishing5%
B24DTools for grinding, buffing or sharpening2%
F16DCouplings for transmitting rotation2%
PatentTitleYear
10,777,943Connector with a conductive shield having a C-shaped ring202010,728,993Driver circuit for providing constant voltage to an auxiliary circuit202010,608,380Connector202010,601,174Electrical connector assembly with a locking device to stabilize the electrical connection202010,570,985High frequency vibration spindle system202010,461,476Connector201910,340,370Asymmetric gated fin field effect transistor (FET) (finFET) diodes201910,326,226Contact with a first cylindrical section, a second cylindrical section, and a transition section and a connector using the same201910,283,912Connector and connector assembly resistant to vibration201910,279,396Machining toolholder201910,219,361Driver circuit for providing constant voltage to an auxiliary circuit201910,034,355Driver circuit for providing constant voltage to an auxiliary circuit20189,954,305Electric connector20189,689,919'Method and apparatus for testing memory'20179,622,358'Method for forming a circuit board via structure for high speed signaling'20179,478,908'Electrical connector'20169,356,361'Electrical connector for strip cable'20169,055,702'Method for forming a circuit board via structure for high speed signaling'20158,516,695'Method for forming a circuit board via structure for high speed signaling'20137,992,297'Method for forming a circuit board via structure for high speed signaling'20117,676,919'Method for forming a circuit board via structure for high speed signaling'20107,459,638'Absorbing boundary for a multi-layer circuit board structure'20086,744,643'Push-pull booster circuit with a pair of inductors for coupling'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2017Patents assigned to MICRON TECHNOLOGY INC (6)· patent assignee history
2008–2017Based in Boise, ID, US· patent location history
2013–2020Patents assigned to WANG HAO (5)· patent assignee history
2016–2020Patents assigned to TYCO ELECTRONICS SHANGHAI CO LTD (9)· patent assignee history
2016–2020Based in Shanghai, CN· patent location history
2018–2020Patents assigned to CHEN TIMOTHY (3)· patent assignee history
2018–2020Patents assigned to HUSSEY ANDREW (3)· patent assignee history
2018–2020Based in Twinsburg, OH, US· patent location history
2019–2020Based in Taichung, TW· patent location history
2019Based in San Diego, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TYCO ELECTRONICS SHANGHAI CO LTD | 9 | 2016–2020 |
| MICRON TECHNOLOGY INC | 6 | 2008–2017 |
| WANG HAOself | 5 | 2013–2020 |
| CHEN TIMOTHY | 3 | 2018–2020 |
| HUSSEY ANDREW | 3 | 2018–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shanghai, CN | 9 | 2016–2020 |
| Boise, ID, US | 6 | 2008–2017 |
| Twinsburg, OH, US | 3 | 2018–2020 |
| Taichung, TW | 2 | 2019–2020 |
| San Diego, California, US | 1 | 2019 |