Inventor

Eugene H. Ratzlaff

Inventor
Hopewell Junction, NY, US

Overview

24→
Patents
1994–2010
Patent span
Physics
Primary field (CPC G)

Patents· 24 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
B24BMachines, devices, or processes for grinding or polishing19%
G01NInvestigating or analysing materials by determining their chemical or physical properties15%
G06FElectric digital data processing15%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices9%
G06VImage or video recognition or understanding9%
G01BMeasuring length, thickness or similar linear dimensions4%
H04NPictorial communication, e.g. television4%
G10LSpeech analysis techniques or speech synthesis2%
PatentTitleYear
7,705,754'Method and system for the compression of probability tables'20107,627,596'Retrieving handwritten documents using multiple document recognizers and techniques allowing both typed and handwritten queries'20097,502,017'Handwriting recognizer user interface methods'20097,400,277'Method and system for the compression of probability tables'20087,260,779'Methods and apparatus for automatic page break detection'20076,826,306'System and method for automatic quality assurance of user enrollment in a recognition system'20046,757,647'Method for encoding regular expressions in a lexigon'20046,603,881'Spatial sorting and formatting for handwriting recognition'20036,401,067'System and method for providing user-directed constraints for handwriting recognition'20026,333,994'Spatial sorting and formatting for handwriting recognition'20016,326,957'System and method for displaying page information in a personal digital notepad'20015,788,801'Real time measurement of etch rate during a chemical etching process'19985,582,746'Real time measurement of etch rate during a chemical etching process'19965,573,624'Chemical etch monitor for measuring film etching uniformity during a chemical etching process'19965,573,623'Apparatus for contactless real-time in-situ monitoring of a chemical etching process'19965,516,399'Contactless real-time in-situ monitoring of a chemical etching'19965,501,766'Minimizing overetch during a chemical etching process'19965,500,073'Real time measurement of etch rate during a chemical etching process'19965,489,361'Measuring film etching uniformity during a chemical etching process'19965,480,511'Method for contactless real-time in-situ monitoring of a chemical etching process'19965,456,788'Method and apparatus for contactless real-time in-situ monitoring of a chemical etching process'19955,451,289'Fixture for in-situ noncontact monitoring of wet chemical etching with passive wafer restraint'19955,445,705'Method and apparatus for contactless real-time in-situ monitoring of a chemical etching process'19955,338,390'Contactless real-time in-situ monitoring of a chemical etching process'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994–2010Patents assigned to IBM (24)· patent assignee history
1994–2010Based in Hopewell Junction, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM241994–2010
Locations
LocationPatentsSpan
Hopewell Junction, New York, US241994–2010