Inventor
David B. Goland
Inventor
Croton-on-Hudson, NY, US
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H05KPrinted circuits17%
Y10TTechnical subjects covered by former us classification16%
C04BLime, magnesia12%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests11%
C22CAlloys5%
B22FWorking metallic powder4%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices2%
PatentTitleYear
6,652,956'X-ray printing personalization technique'20036,638,681'X-ray printing personalization technique'20036,373,133'Multi-chip module and heat-sink cap combination'20026,352,014'Method for making punches using multi-layer ceramic technology'20026,306,528'Method for the controlling of certain second phases in aluminum nitride'20016,262,390'Repair process for aluminum nitride substrates'20016,200,373'Method for controlling of certain second phases in aluminum nitride'20016,096,565'Multi-layer glass ceramic module with superconductor wiring'20006,004,624'Method for the controlling of certain second phases in aluminum nitride'19996,002,951'Multi-layer ceramic substrate having high TC superconductor circuitry'19995,981,310'Multi-chip heat-sink cap assembly'19995,932,043'Method for flat firing aluminum nitride/tungsten electronic modules'19995,891,543'Apparatus and method for screening using electrostatic adhesion'19995,763,093'Aluminum nitride body having graded metallurgy'19985,759,669'Apparatus and method for screening green sheet with via hole using porous backing material'19985,682,589'Aluminum nitride body having graded metallurgy'19975,635,000'Method for screening using electrostatic adhesion'19975,552,107'Aluminum nitride body having graded metallurgy'19965,552,232'Aluminum nitride body having graded metallurgy'19965,480,503'Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof'19965,292,477'Supersaturation method for producing metal powder with a uniform distribution of dispersants method of uses thereof and structures fabricated therewith'19945,245,136'Hermetic package for an electronic device'19935,194,196'Hermetic package for an electronic device and method of manufacturing same'19935,177,594'Semiconductor chip interposer module with engineering change wiring and distributed decoupling capacitance'19935,169,310'Hermetic package for an electronic device and method of manufacturing same'19925,147,484'Method for producing multi-layer ceramic substrates with oxidation resistant metalization'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992–2003Patents assigned to IBM (26)· patent assignee history
1992–1994Based in Bedford Hills, NY, US· patent location history
1996–1998Patents assigned to CARBORUNDUM CO (3)· patent assignee history
1996–1998Based in Croton, NY, US· patent location history
1997–2002Based in Croton-on-Hudson, NY, US· patent location history
1999–2001Based in Sopot, PL· patent location history
2001–2003Based in New Paltz, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 26 | 1992–2003 |
| CARBORUNDUM CO | 3 | 1996–1998 |
Locations
| Location | Patents | Span |
|---|---|---|
| Croton-on-Hudson, New York, US | 7 | 1997–2002 |
| Bedford Hills, New York, US | 6 | 1992–1994 |
| Croton, New York, US | 5 | 1996–1998 |
| New Paltz, New York, US | 4 | 2001–2003 |
| Sopot, PL | 4 | 1999–2001 |