Inventor

Chen-Hua Yu

Inventor

Hsinchu, TW

Overview

1991–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 1,244 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%

H01LSemiconductor devices25%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%

H10DInorganic electric semiconductor devices6%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%

H10HInorganic light-emitting semiconductor devices having potential barriers2%

H05KPrinted circuits1%

H01QAntennas, i.e. radio aerials1%

Y10TTechnical subjects covered by former us classification1%

C23CCoating metallic material1%

PatentTitleYear

10,879,220Package-on-package structure and manufacturing method thereof2020 10,879,153Chip package structure2020 10,879,183Semiconductor device and method of manufacture2020 10,878,073Fingerprint sensor pixel array and methods of forming same2020 10,872,878Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof2020 10,872,842Semiconductor device and manufacturing method thereof2020 10,872,874Bonding apparatus and method of bonding substrates2020 10,872,836Package structure for heat dissipation2020 10,872,865Electric magnetic shielding structure in packages2020 10,867,911InFO coil structure and methods of manufacturing same2020 10,867,941Semiconductor device and method2020 10,867,929Semiconductor structures and methods of forming the same2020 10,867,900Dummy metal with zigzagged edges2020 10,867,936Semiconductor device with shield for electromagnetic interference2020 10,867,939Package structure and method of fabricating the same2020 10,867,985Method and structure of three-dimensional chip stacking2020 10,867,965Package structures and methods of forming the same2020 10,867,949Substrate design for semiconductor packages and method of forming same2020 10,867,885Heat spreading device and method2020 10,867,938Package structure2020 10,867,884Heat spreading device and method2020 10,867,879Integrated circuit package and method2020 10,866,373Optical transceiver and manufacturing method thereof2020 10,867,811Semiconductor device2020 10,867,874Semiconductor device and method2020 10,867,960Device package including molding compound having non-planar top surface around a die and method of forming same2020 10,867,947Semiconductor packages and methods of manufacturing the same2020 10,867,832Apparatus for holding semiconductor wafers2020 10,867,878Dam for three-dimensional integrated circuit2020 10,867,958Integrated circuit with a thermally conductive underfill2020 10,869,385Semiconductor device, circuit board structure and method of fabricating the same2020 10,867,982Hybrid integrated circuit package and method2020 10,861,835Solution for reducing poor contact in InFO package2020 10,861,809Semiconductor structure and method of forming2020 10,861,773Semiconductor package and manufacturing method thereof2020 10,859,922Lithography system and method2020 10,861,814Integrated fan-out packages and methods of forming the same2020 10,854,580Semiconductor structure along with multiple chips bonded through microbump and manufacturing method thereof2020 10,853,616Fingerprint sensor device and method2020 10,854,552Semiconductor device and method of manufacture2020 10,854,568Packages with Si-substrate-free interposer and method forming same2020 10,854,5773D die stacking structure with fine pitches2020 10,847,505Multi-chip semiconductor package2020 10,847,304InFO coil on metal plate with slot2020 10,847,459Semiconductor die contact structure and method2020 10,847,414Embedded 3D interposer structure2020 10,847,493Bump-on-trace interconnect2020 10,840,217Stacked chip package and methods of manufacture thereof2020 10,840,227Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device2020 10,840,218Semiconductor device and method of manufacture2020 10,833,039Multi-chip fan out package and methods of forming the same2020 10,833,030Semiconductor device and method of manufacture2020 10,832,985Sensor package and method2020 10,825,693Carrier warpage control for three dimensional integrated circuit (3DIC) stacking2020 10,825,798Packages with stacked dies and methods of forming the same2020 10,825,773Package structure with reinforcement structures in a redistribution circuit structure and method of manufacturing the same2020 10,825,696Cross-wafer RDLs in constructed wafers2020 10,825,602Stacked coil for wireless charging structure on InFO package2020 10,818,607Semiconductor device and method of manufacture2020 10,818,640Die stacks and methods forming same2020 10,811,389Semiconductor package for thermal dissipation2020 10,811,394Devices employing thermal and mechanical enhanced layers and methods of forming same2020 10,811,404Package structure and method of manufacturing the same2020 10,804,178Integrated circuit package and method of forming same2020 10,804,242Methods of forming multi-die package structures including redistribution layers2020 10,804,247Chip package structure with conductive shielding film2020 10,797,031Semiconductor package2020 10,796,927Integrated circuit package pad and methods of forming2020 10,797,038Semiconductor package and rework process for the same2020 10,796,990Semiconductor structure, package structure, and manufacturing method thereof2020 10,790,261Bonding through multi-shot laser reflow2020 10,790,269Semiconductor devices and semiconductor structures2020 10,790,244Semiconductor device and method2020 10,784,162Method of making a semiconductor component having through-silicon vias2020 10,784,207Multi-stacked package-on-package structures2020 10,784,248Multi-stack package-on-package structures2020 10,777,502Semiconductor chip, package structure, and pacakge-on-package structure2020 10,777,430Photonic integrated package and method forming same2020 10,777,518Package structure and method of manufacturing the same2020 10,770,365Package structures and methods of forming the same2020 10,770,428Semiconductor device and method2020 10,772,205Circuit board, semiconductor device including the same, and manufacturing method thereof2020 10,770,655CHIP package2020 10,770,795Antenna device and method for manufacturing antenna device2020 10,763,164Package structure with inductor and method of forming thereof2020 10,763,229Semiconductor structure2020 10,756,010Semiconductor device packaging structure having through interposer vias and through substrate vias2020 10,748,841Packages with Si-substrate-free interposer and method forming same2020 10,748,870Tri-layer COWOS structure2020 10,746,923Photonic semiconductor device and method2020 10,734,295Interposer test structures and methods2020 10,734,323Package structures2020 10,734,279Semiconductor package device with integrated antenna and manufacturing method thereof2020 10,734,345Packaging through pre-formed metal pins2020 10,734,348Bonded semiconductor devices and methods of forming the same2020 10,727,201Packages formed using RDL-last process2020 10,727,217Method of manufacturing semiconductor device that uses bonding layer to join semiconductor substrates together2020 10,720,388Wireless charging package with chip integrated in coil center2020 10,720,788Wireless charging devices having wireless charging coils and methods of manufacture thereof2020 10,720,409Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same2020 10,714,414Planarizing RDLS in RDL--First Processes Through CMP Process2020 10,714,359Substrate design for semiconductor packages and method of forming same2020 10,714,426Semiconductor package and method of forming the same2020 10,714,457Semiconductor packages and methods of forming same2020 10,707,173Package structure and manufacturing method thereof2020 10,707,094Semiconductor package and manufacturing process thereof2020 10,700,045Surface mount device/integrated passive device on package or device structure and methods of forming2020 10,698,994Fingerprint sensor pixel array and methods of forming same2020 10,700,025Fan-out interconnect structure and method for forming same2020 10,692,817Semiconductor device with shielding structure for cross-talk reduction2020 10,685,937Integrated circuit package having dummy structures and method of forming same2020 10,685,910Packages with Si-substrate-free interposer and method forming same2020 10,685,911Semiconductor package and manufacturing method of the same2020 10,679,968Package with thinned substrate2020 10,679,951Chip-on-substrate packaging on carrier2020 10,679,947Chip package and manufacturing method thereof2020 10,672,647Wafer level chip scale packaging intermediate structure apparatus and method2020 10,672,674Method of forming semiconductor device package having testing pads on a topmost die2020 10,672,741Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same2020 10,672,738Package structures and methods of forming2020 10,663,512Testing of semiconductor chips with microbumps2020 10,665,468Multi-chip structure and method of forming same2020 10,665,540Redistribution layer structures for integrated circuit package2020 10,665,560Optical semiconductor package and method for manufacturing the same2020 10,665,582Method of manufacturing semiconductor package structure2020 10,658,337Packages and packaging methods for semiconductor devices, and packaged semiconductor devices2020 10,658,348Semiconductor devices having a plurality of first and second conductive strips2020 10,658,347Semiconductor packages and methods of forming the same2020 10,658,199Semiconductor device and method2020 10,651,149Packages formed using RDL--last process2020 10,651,675Packaged semiconductor devices with wireless charging means2020 10,651,137Manufacturing method of a package structure2020 10,643,965Structure and method of forming a joint assembly2020 10,643,864Fan-out structure and method of fabricating the same2020 10,636,715Semiconductor package and method of fabricating the same2020 10,638,616Circuit carrier and manifacturing method thereof2020 10,636,748Package structure2020 10,629,477Raised via for terminal connections on different planes2020 10,629,540Semiconductor device and method2020 10,629,508Packaged semiconductor devices and methods of packaging semiconductor devices2020 10,629,537Conductive vias in semiconductor packages and methods of forming same2020 10,629,541Semiconductor structure and manufacturing method thereof2020 10,622,327Method for manufacturing semiconductor structure2020 10,622,297Semiconductor device and method2020 10,622,701Antenna apparatus and method2020 10,622,302Via for semiconductor device connection and methods of forming the same2020 10,622,321Semiconductor structures and methods of forming the same2020 10,566,237Profile of through via protrusion in 3DIC interconnect2020 10,559,546Package on package structure and method for forming the same2020 10,553,569Multi-die structure and method for forming same2020 10,555,424Circuit board, semiconductor device including the same, and manufacturing method thereof2020 10,541,227System on integrated chips and methods of forming same2020 10,541,228Packages formed using RDL-last process2020 10,541,226Package structure and method of forming the same2020 10,535,6313D Chip-on-wager-on-substrate structure with via last process2020 10,535,639Semiconductor device and manufacturing method of the same2020 10,535,913Package structure, electronic device and method of fabricating package structure2020 10,535,629Method of manufacturing semiconductor structure2020 10,530,175Hexagonal semiconductor package structure2020 10,529,666Semiconductor structure and manufacturing method thereof2020 10,529,690Package structures and methods of forming the same2020 10,529,698Semiconductor packages and methods of forming same2020 10,529,637Integrated circuit package and method of forming same2020 10,529,675Info structure and method forming same2020 10,522,449Packages with Si-substrate-free interposer and method forming same2019 10,522,481Post-passivation interconnect structure2019 10,522,473Alignment mark design for packages2019 10,522,501Semiconductor structure and method of forming the same2019 10,522,491Semiconductor device and bump formation process2019 10,515,901InFO-POP structures with TIVs having cavities2019 10,515,829Package system for integrated circuits2019 10,515,940Method and structure of three-dimensional chip stacking2019 10,515,933System, structure, and method of manufacturing a semiconductor substrate stack2019 10,513,070Wafer level transfer molding and apparatus for performing the same2019 10,515,851Method for forming semiconductor device structure with conductive shielding structure2019 10,515,865Underfill control structures and method2019 10,515,921Semiconductor package and method of fabricating semiconductor package2019 10,510,681Semiconductor device2019 10,509,938Fingerprint sensor device and method2019 10,510,630Molding structure for wafer level package2019 10,510,654Dummy metal with zigzagged edges2019 10,510,710Bump-on-trace interconnect2019 10,510,660Semiconductor package devices integrated with inductor2019 10,510,697Semiconductor package system and method2019 10,510,604Semiconductor device and method2019 10,510,674Fan-out package having a main die and a dummy die, and method of forming2019 10,510,634Package structure and method2019 10,510,699Bond structures and the methods of forming the same2019 10,510,731Package-on-package (PoP) structure including stud bulbs2019 10,510,679Semiconductor device with shield for electromagnetic interference2019 10,510,556Integrated circuit package pad and methods of forming2019 10,510,645Planarizing RDLs in RDL-first processes through CMP process2019 10,510,735Packages and methods of forming packages2019 10,510,701Semiconductor die connection system and method2019 10,510,478Stacked coil for wireless charging structure on InFO package2019 10,510,682Semiconductor device with shield for electromagnetic interference2019 10,510,698Semiconductor structure and method of forming2019 10,510,629Integrated circuit package and method of forming same2019 10,510,716Packaged semiconductor devices and methods of packaging semiconductor devices2019 10,510,695Package structure and method of forming the same2019 10,510,650Method of manufacturing semiconductor device packaging structure having through interposer vias and through substrate vias2019 10,510,719Methods of packaging semiconductor devices and packaged semiconductor devices2019 10,510,717Chip on package structure and method2019 10,510,715Semiconductor structure and manufacturing method thereof2019 10,510,670Pad structure design in fan-out package2019 10,504,877Surface mount device/integrated passive device on package or device structure and methods of forming2019 10,504,810Polymer-based-semiconductor structure with cavity2019 10,504,835Package structure, semiconductor chip and method of fabricating the same2019 10,497,616Embedded 3D interposer structure2019 10,498,0093D antenna for integrated circuits2019 10,497,668Integrated fan-out package including voltage regulators and methods forming same2019 10,497,619Method of manufacturing a semiconductor device including through silicon plugs2019 10,490,540Multi-stack package-on-package structures2019 10,483,187Heat spreading device and method2019 10,483,617Package structure2019 10,481,351Semicondcutor packages2019 10,475,747Integrated fan-out package and method for fabricating the same2019 10,475,768Redistribution layers in semiconductor packages and methods of forming same2019 10,475,759Integrated circuit structure having dies with connectors of different sizes2019 10,475,755Semiconductor structure2019 10,475,764Die bonder and methods of using the same2019 10,468,377Device package including molding compound having non-planar top surface around a die2019 10,468,355EMI Shielding structure in InFO package2019 10,468,385Semiconductor structure including plurality of chips along with air gap and manufacturing method thereof2019 10,461,036Multi-stacked package-on-package structures2019 10,461,034Package structure and manufacturing method thereof2019 10,460,987Semiconductor package device with integrated antenna and manufacturing method thereof2019 10,461,022Semiconductor package structure and manufacturing method thereof2019 10,453,815Methods and apparatus for solder connections2019 10,431,738Integrated fan-out package and method for fabricating the same2019 10,381,298Packages with Si-substrate-free interposer and method forming same2019 10,381,309Package structure having connecting module2019 10,371,893Hybrid interconnect device and method2019 10,373,8853D stacked-chip package2019 10,366,953Redistribution layer structures for integrated circuit package2019 10,368,442Integrated circuit structure and method of forming2019 10,361,161Semiconductor device and method of manufacture2019 10,361,122Processes for reducing leakage and improving adhesion2019 10,354,964Integrated devices in semiconductor packages and methods of forming same2019 10,354,114Fingerprint sensor in InFO structure and formation method2019 10,354,961Routing design of dummy metal cap and redistribution line2019 10,354,983Integrated circuit package and methods of forming same2019 10,347,606Devices employing thermal and mechanical enhanced layers and methods of forming same2019 10,347,607Semiconductor devices and methods of manufacture thereof2019 10,347,612Solution for reducing poor contact in InFO package2019 10,340,206Dense redistribution layers in semiconductor packages and methods of forming the same2019 10,340,236Semiconductor device and method of manufacture2019 10,340,249Semiconductor device and method2019 10,340,226Interconnect crack arrestor structure and methods2019 10,333,623Optical transceiver2019 10,332,838Schemes for forming barrier layers for copper in interconnect structures2019 10,332,841System on integrated chips and methods of forming the same2019 10,325,853Method of forming semiconductor packages having through package vias2019 10,325,879Fan-out stacked system in package (SIP) and the methods of making the same2019 10,319,690Semiconductor structure and manufacturing method thereof2019 10,319,701Bonded 3D integrated circuit (3DIC) structure2019 10,319,655POP structures with dams encircling air gaps and methods for forming the same2019 10,319,683Multi-stacked package-on-package structures2019 10,319,681Dummy features in redistribution layers (RDLS) and methods of forming same2019 10,319,699Chip package having die structures of different heights2019 10,312,203Structure and formation method of chip package with antenna element2019 10,312,327FinFETs having dielectric punch-through stoppers2019 10,312,204System and method for an improved interconnect structure2019 10,304,801Redistribution layers in semiconductor packages and methods of forming same2019 10,304,614Stacked coil for wireless charging structure on InFO package2019 10,304,700Semiconductor device and method2019 10,297,471Fan-out structure and method of fabricating the same2019 10,297,494Raised via for terminal connections on different planes2019 10,297,560Semiconductor device and method2019 10,297,5503D IC architecture with interposer and interconnect structure for bonding dies2019 10,297,579Package on-package structure with epoxy flux residue2019 10,297,925Semiconductor device including integrated fan out antenna and method of forming the same2019 10,290,584Conductive vias in semiconductor packages and methods of forming same2019 10,290,611Semiconductor packages and methods of forming same2019 10,290,609Semiconductor device and manufacturing method of the same2019 10,290,571Packages with si-substrate-free interposer and method forming same2019 10,290,513Carrier warpage control for three dimensional integrated circuit (3DIC) stacking2019 10,283,473Package structure and manufacturing method thereof2019 10,283,470Semiconductor package and manufacturing method thereof2019 10,283,427Molding structure for wafer level package2019 10,283,461Info structure and method forming same2019 10,283,375Integrated circuit package pad and methods of forming2019 10,276,4013D shielding case and methods for forming the same2019 10,276,402Semiconductor package and manufacturing process thereof2019 10,276,920Package structure, electronic device and method of fabricating package structure2019 10,269,732Info package with integrated antennas or inductors2019 10,269,737Method for manufacturing semiconductor structure2019 10,269,904Semiconductor structure and manufacturing method thereof2019 10,269,773Semiconductor packages and methods of forming the same2019 10,269,741Bond structures and the methods of forming the same2019 10,269,619Wafer level chip scale packaging intermediate structure apparatus and method2019 10,269,757Integrated circuit with a thermally conductive underfill and methods of forming same2019 10,269,616Method of fabricating semiconductor device isolation structure2019 10,269,723Alignment mark design for packages2019 10,269,673Packaged semiconductor devices and methods of packaging semiconductor devices2019 10,268,868Fingerprint sensor device and method2019 10,269,481Stacked coil for wireless charging structure on InFO package2019 10,269,728Semiconductor device with shielding structure for cross-talk reduction2019 10,269,489Programmable inductor2019 10,269,762Rework process and tool design for semiconductor package2019

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1991–1999Based in Allentown, PA, US· patent location history

1996–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (566)· patent assignee history

1996–2011Based in Keelung, TW· patent location history

1997–2020Based in Hsinchu, TW· patent location history

1997–2002Based in Hsin Chu, TW· patent location history

2011–2018Patents assigned to YU CHEN-HUA (223)· patent assignee history

2011–2016Patents assigned to CHIOU WEN-CHIH (58)· patent assignee history

2012–2018Patents assigned to JENG SHIN-PUU (42)· patent assignee history

2015–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (634)· patent assignee history

2017–2019Based in Hinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	634	2015–2020
TAIWAN SEMICONDUCTOR MFG	566	1996–2016
YU CHEN-HUAself	223	2011–2018
CHIOU WEN-CHIH	58	2011–2016
JENG SHIN-PUU	42	2012–2018

Locations

Location	Patents	Span
Hsinchu, TW	1193	1997–2020
Keelung, TW	20	1996–2011
Allentown, Pennsylvania, US	19	1991–1999
Hsin Chu, TW	3	1997–2002
Hinchu, TW	2	2017–2019