Inventor

Charles W. Eichelberger

Inventor

Schenectady, NY, US

Overview

1976–2013

Patent span

Electricity

Primary field (CPC H)

Patents· 131 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%

H05KPrinted circuits12%

Y10TTechnical subjects covered by former us classification10%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%

H05BElectric heating6%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%

G01RMeasuring electric variables3%

Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications3%

H02JElectric power networks3%

H03MCoding3%

PatentTitleYear

8,590,145'Method of fabricating a circuit structure'2013 8,564,119'Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system'2013 8,533,941'Method of bonding two structures together with an adhesive line of controlled thickness'2013 8,474,133'Method of fabricating a base layer circuit structure'2013 8,384,199'Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system'2013 8,324,020'Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system'2012 8,169,065'Stackable circuit structures and methods of fabrication thereof'2012 7,868,445'Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layer'2011 7,863,090'Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system'2011 7,830,000'Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system'2010 7,619,901'Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system'2009 7,112,467'Structure and method for temporarily holding integrated circuit chips in accurate alignment'2006 6,818,544'Compliant, solderable input/output bump structures'2004 6,555,908'Compliant, solderable input/output bump structures'2003 6,426,545'Integrated circuit structures and methods employing a low modulus high elongation photodielectric'2002 6,396,148'Electroless metal connection structures and methods'2002 6,159,767'Single chip modules, repairable multichip modules, and methods of fabrication thereof'2000 5,897,728'Integrated circuit test structure and test process'1999 5,841,193'Single chip modules, repairable multichip modules, and methods of fabrication thereof'1998 5,452,182'Flexible high density interconnect structure and flexibly interconnected system'1995 5,359,496'Hermetic high density interconnected electronic system'1994 5,355,102'HDI impedance matched microwave circuit assembly'1994 5,348,607'High density interconnect thermoplastic die attach material and solvent die attach processing'1994 5,331,203'High density interconnect structure including a chamber'1994 5,258,647'Electronic systems disposed in a high force environment'1993 5,250,843'Multichip integrated circuit modules'1993 5,241,456'Compact high density interconnect structure'1993 5,225,023'High density interconnect thermoplastic die attach material and solvent die attach processing'1993 5,214,655'Integrated circuit packaging configuration for rapid customized design and unique test capability'1993 5,200,810'High density interconnect structure with top mounted components'1993 5,157,589'Mutliple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing T.sub.G \' s'1992 5,154,793'Method and apparatus for removing components bonded to a substrate'1992 5,151,776'Die attachment method for use in high density interconnected assemblies'1992 5,149,662'Methods for testing and burn-in of integrated circuit chips'1992 5,144,747'Apparatus and method for positioning an integrated circuit chip within a multichip module'1992 5,144,407'Semiconductor chip protection layer and protected chip'1992 5,111,278'Three-dimensional multichip module systems'1992 5,107,586'Method for interconnecting a stack of integrated circuits at a very high density'1992 5,108,825'Epoxy/polyimide copolymer blend dielectric and layered circuits incorporating it'1992 5,104,480'Direct patterning of metals over a thermally inefficient surface using a laser'1992 5,094,709'Apparatus for packaging integrated circuit chips employing a polymer film overlay layer'1992 5,091,769'Configuration for testing and burn-in of integrated circuit chips'1992 5,091,893'Ultrasonic array with a high density of electrical connections'1992 5,019,535'Die attachment method using nonconductive adhesive for use in high density interconnected assemblies'1991 5,019,946'High density interconnect with high volumetric efficiency'1991 5,018,150'Reflector switched lasers'1991 4,937,203'Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer'1990 4,933,042'Method for packaging integrated circuit chips employing a polymer film overlay layer'1990 4,918,811'Multichip integrated circuit packaging method'1990 4,901,136'Multi-chip interconnection package'1990 4,894,115'Laser beam scanning method for forming via holes in polymer materials'1990 4,884,122'Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer'1989 4,878,991'Simplified method for repair of high density interconnect circuits'1989 4,866,508'Integrated circuit packaging configuration for rapid customized design and unique test capability'1989 4,842,677'Excimer laser patterning of a novel resist using masked and maskless process steps'1989 4,835,704'Adaptive lithography system to provide high density interconnect'1989 4,783,695'Multichip integrated circuit packaging configuration and method'1988 4,780,177'Excimer laser patterning of a novel resist'1988 4,770,921'Self-shielding multi-layer circuit boards'1988 4,714,516'Method to produce via holes in polymer dielectrics for multiple electronic circuit chip packaging'1987 4,656,475'Method and apparatus for controlling distributed electrical loads'1987 4,646,135'System for allowing two television programs simultaneously to use the normal bandwidth for one program by chrominance time compression and luminance bandwidth reduction'1987 4,646,152'Sharpness enhanced equal bandwidth luminance bandwidth compression system'1987 4,646,151'Television frame synchronizer with independently controllable input/output rates'1987 4,646,149'Alternate field luminance enhancement in a spectrum conserving television system'1987 4,598,286'Method and apparatus for controlling distributed electrical loads'1986 4,571,322'Method for providing insulated holes in conducting substrate'1986 4,535,332'Method and apparatus for controlling distributed electrical loads'1985 4,528,748'Method for fabricating a printed circuit board of desired shape'1985 4,522,888'Electrical conductors arranged in multiple layers'1985 4,511,895'Method and apparatus for controlling distributed electrical loads'1985 4,495,251'Shielded plastic microwave oven cavity'1985 4,489,385'Method and apparatus for controlling distributed electrical loads'1984 4,487,811'Electrical conductor'1984 4,484,258'Apparatus for controlling distributed electrical loads'1984 4,484,295'Control circuit and method for varying the output of a waveform generator to gradually or rapidly vary a control signal from an initial value to a desired value'1984 4,470,883'Additive printed circuit process'1984 4,466,850'Method for fabricating a one-time electrically activated switch'1984 4,441,015'Cooking apparatus employing a rotisserie mode with stationary food'1984 4,438,291'Screen-printable thermocouples'1984 4,438,158'Method for fabrication of electrical resistor'1984 4,435,679'Programmable signal amplitude control circuits'1984 4,430,557'Cooking apparatus having internal pressurizing source and _integral heat source _'1984 4,425,628'Control module for engergy management system'1984 4,416,914'Electrical conductors arranged in multiple layers and preparation thereof'1983 4,414,501'Programmable signal amplitude control circuits'1983 4,404,237'Fabrication of electrical conductor by replacement of metallic powder in polymer with more noble metal'1983 4,396,844'Method and apparatus for controlling distributed electrical loads'1983 4,388,566'Passive control network for remote control of load output level'1983 4,386,347'Method of, and apparatus for, increased resolution slewing of a bar-graph-display data input/output system'1983 4,385,082'Preparation of shielded plastic microwave oven'1983 4,380,749'One-time electrically-activated switch'1983 4,377,505'Electrical resistor and fabrication thereof'1983 4,376,969'Control signal and isolation circuits'1983 4,367,414'Method and apparatus for controlling distributed electrical loads'1983 4,362,903'Electrical conductor interconnect providing solderable connections to hard-to-contact substrates, such as liquid crystal cells'1982 4,345,236'Abrasion-resistant screen-printed potentiometer'1982 4,345,200'Load output level control circuit'1982 4,310,896'Method of interfacing remote units to a central microprocessor'1982 4,301,509'Method for cooking meat or poultry in thermal oven'1981 4,298,789'Oven having a cavity heated by at least one monolithic integrated heat source'1981 4,296,296'Controllable-duty-cycle power supply for microwave oven magnetron and the like'1981 4,296,449'Relay switching apparatus'1981 4,291,303'Touch pad and display tube circuitry'1981 4,290,052'Capacitive touch entry apparatus having high degree of personal safety'1981 4,268,779'Circuit for controlling current flow from an A.C. source to a load'1981 4,262,213'Universal power module'1981 4,250,494'Charge transfer analog-to-digital converter with precise charge control'1981 4,250,504'Gas discharge display circuit'1981 4,213,182'Programmable energy load controller system and methods'1980 4,212,057'Shared memory multi-microprocessor computer system'1980 4,211,931'Electronic speed error signal processing circuit'1980 4,196,360'Interface driver circuit'1980 4,180,807'Charge transfer circuit with voltage threshold compensating means'1979 4,168,531'Real-time clock having programmable time initialization and read-out'1979 4,167,786'Load control processor'1979 4,165,478'Reference voltage source with temperature-stable MOSFET amplifier'1979 4,158,804'MOSFET Reference voltage circuit'1979 4,145,748'Self-optimizing touch pad sensor circuit'1979 4,138,666'Charge transfer circuit with threshold voltage compensating means'1979 4,138,665'Preamplifier for analog to digital converters'1979 4,121,461'Electronic temperature sensor'1978 4,117,353'Controlled current sink'1978 4,091,361'Noise-immune carrier current actuated control'1978 4,074,260'Analog-to-digital converter'1978 4,070,600'High voltage driver circuit'1978 4,070,666'Automatic polarity sensing analog-to-digital converter'1978 4,070,667'Charge transfer analog-to-digital converter'1978 4,065,766'Analog-to-digital converter'1977 4,039,940'Capacitance sensor'1977 4,000,418'Apparatus for storing and retrieving analog and digital signals'1976

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1976–1994Patents assigned to GEN ELECTRIC (105)· patent assignee history

1976–2000Based in Schenectady, NY, US· patent location history

1992–2013Patents assigned to EICHELBERGER CHARLES W (9)· patent assignee history

1992–1993Patents assigned to INTEGRATED SYSTEM ASSEMBLIES (3)· patent assignee history

1998–2013Patents assigned to EPIC TECHNOLOGIES INC (18)· patent assignee history

2002–2013Based in Wakefield, MA, US· patent location history

2006Based in Reading, MA, US· patent location history

2012–2013Patents assigned to KOHL JAMES E (7)· patent assignee history

2013Based in Wakefiled, MA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
GEN ELECTRIC	105	1976–1994
EPIC TECHNOLOGIES INC	18	1998–2013
EICHELBERGER CHARLES Wself	9	1992–2013
KOHL JAMES E	7	2012–2013
INTEGRATED SYSTEM ASSEMBLIES	3	1992–1993

Locations

Location	Patents	Span
Schenectady, New York, US	115	1976–2000
Wakefield, Massachusetts, US	14	2002–2013
Wakefiled, Massachusetts, US	1	2013
Reading, Massachusetts, US	1	2006