Inventor
Bin Zhao
Inventor
Irvine, CA, US
Overview
Patents· 147 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
H04LTransmission of digital information, e.g. telegraphic communication8%
H05BElectric heating6%
G06FElectric digital data processing5%
G02BOptical elements, systems or apparatus5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
H04MTelephonic communication4%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems3%
H04WWireless communication networks3%
H10DInorganic electric semiconductor devices3%
PatentTitleYear
11,036,075Color filter substrate and liquid crystal display panel202111,030,964Image display processing method and device, display device and non-volatile storage medium202110,878,530Display method and display device202010,872,436Spatial positioning method, spatial positioning device, spatial positioning system and computer readable storage medium202010,859,877Display panel, manufacturing method therof, and display device202010,821,712Low crystalline polypropylene-based polymer for blown film applications202010,827,274Diaphragm for producing sound and speaker using same202010,768,879Image processing method and apparatus, virtual reality apparatus, and computer-program product202010,764,5683D display device, method for controlling the same and computing device202010,680,742Systems and methods for improved communication packet delivery over a public network202010,671,201Touch substrate, touch display panel and display device202010,659,882Diaphragm for producing sound and speaker using same202010,649,230Parallax barrier panel, display substrate, display device, electronic equipment and display method202010,626,699Dissolvable, variable-diameter metal sealing and fracturing bridge plug202010,581,710Systems and methods for improved quality of a visualized call over network through scenario based buffer modulation202010,563,809Loose lining structure based on a tantalum plate and a steel clad plate and manufacturing method thereof202010,567,757Dynamic reference picture reconstruction202010,497,351Packaging structure of acoustic absorbent and speaker box using same201910,472,776Vehicle power compartment and engineering vehicle provided with same201910,412,145Systems and methods for optimization of transmission of real-time data via network labeling201910,388,925Battery module201910,254,601Liquid crystal display panel and display device including the same201910,250,987Carbon fiber dome and manufacturing method for same201910,237,592Method and apparatus for video transmission201910,097,925Diaphragm dome, method for manufacturing the same and speaker201810,060,522Screw device cooling nozzle and motion guide device cooling nozzle20189,986,049Systems and methods for selection of a best server for real-time packet transmission20189,967,824Mobile terminal managing method and system, mobile terminal20189,946,611Method, apparatus and system for matching devices20189,935,866Systems and methods for last mile optimization of transmission of real-time data20189,917,756'Systems and methods for visualizing a call over network with a caller readiness dialog box'20189,905,361'Manufacturing method of common grain-oriented silicon steel with high magnetic induction'20189,885,083'Protein detection using FET'20189,871,709'Systems and methods for improved quality of a visualized call over network through scenario based buffer modulation'20189,838,544Systems and methods for improved quality of a call over network with load leveling and last mile signal indication20179,805,268'System and method for processing a video stream to extract highlights'20179,786,655'Display panel and display device'20179,787,565'Systems and methods for a call over network with a visualized summary'20179,749,205'Systems and methods for visualizing a call over network'20179,703,675'Structured logging and instrumentation framework'20179,654,369'Mobile terminal network port management method and device'20179,590,501'Fast load transient response power supply system using dynamic reference generation'20179,557,340'Assays for detection of phenylalanine ammonia-lyase and antibodies to phenylalanine ammonia-lyase'20179,515,920'Name-based neighbor discovery and multi-hop service discovery in information-centric networks'20169,490,792'Pulse width modulation with effective high duty resolution'20169,479,412'Systems and methods for improved quality of a visualized call over network through pathway testing'20169,420,626'Method and device for managing release of network port of mobile terminal'20169,410,982'Photothermal actuation of a probe for scanning probe microscopy'20169,291,641'Probe actuation'20169,222,958'Beam scanning system'20159,178,871'Authentication and authorization method and system'20159,135,212'System and method for registering an electronic device'20158,957,657'Startup of DC-DC converters utilizing multiple power segments'20158,860,595'Scalable voltage ramp control for power supply systems'20148,857,111'Composite damper'20148,778,226'Luminescent systems based on the isolation of conjugated PI systems and edge charge compensation with polar molecules on a charged nanostructured surface'20148,742,741'Apparatus and methods of soft-start in a hysteretic power converter'20148,725,238'Electrocardiogram signal processing system'20148,697,088'VLPs derived from cells that do not express a viral matrix or core protein'20148,633,680'Differential sensing for voltage control in a power supply circuit'20148,599,915'Phase-shifted pulse width modulation signal generation device and method therefor'20138,578,213'Analyzing software performance issues'20138,540,542'Transparent conductive nano-composites'20138,493,003'Serial cascade of minimium tail voltages of subsets of LED strings for dynamic power control in LED displays'20138,422,170'Suspension having bonding pads with solder layers, manufacturing method of a suspension, and connecting method between a suspension and a slider'20138,373,643'Frequency synthesis and synchronization for LED drivers'20138,320,081'Magnetic recording head, head gimbal assembly, and disk drive unit with the same'20128,305,007'Analog-to-digital converter with non-uniform accuracy'20128,279,144'LED driver with frame-based dynamic power management'20128,237,700'Synchronized phase-shifted pulse width modulation signal generation'20128,228,098'Pulse width modulation frequency conversion'20128,206,845'Battery cover assembly for portable electronic device'20128,188,771'Pulse width modulation frequency conversion'20128,179,051'Serial configuration for dynamic power control in LED displays'20128,169,245'Duty transition control in pulse width modulation signaling'20128,154,878'Chip card holder'20128,115,414'LED driver with segmented dynamic headroom control'20128,104,169'Automatic assembly jig'20128,106,604'LED driver with dynamic power management'20128,062,782'Battery latching device for portable electronic device'20118,049,439'LED driver with dynamic headroom control'20118,040,079'Peak detection with digital conversion'20118,035,314'Method and device for LED channel managment in LED driver'20118,035,315'LED driver with feedback calibration'20117,923,922'Transparent conductive nano-composites'20117,843,242'Phase-shifted pulse width modulation signal generation'20107,825,610'LED driver with dynamic power management'20107,804,258'Circuit for providing an approximately constant resistance and/or current and method therefor'20107,713,709'Assay for detection of antibodies to lysosomal enzymes'20107,586,295'Voltage up-conversion circuit'20097,584,370'Circuits, switch assemblies, and methods for power management in an interface that maintains respective voltage differences between terminals of semiconductor devices in open and close switch states and over a range of voltages'20097,523,163'Distributed network system architecture for collaborative computing'20097,483,068'Red eye removal user interface for a portable device'20097,484,115'Fault-tolerant server for collaborative computing'20097,408,330'Voltage up-conversion circuit using low voltage transistors'20087,353,253'Peer-to-peer messaging system'20087,254,268'Object extraction'20077,173,318'On-chip inductors'20077,130,883'Distributed network system architecture for collaborative computing'20067,109,125'Selective fabrication of high capacitance density areas in a low dielectric constant material'20067,073,127'Video editing GUI with layer view'20067,069,298'Fault-tolerant distributed system for collaborative computing'20067,060,557'Fabrication of high-density capacitors for mixed signal/RF circuits'20067,056,822'Method of fabricating an interconnect structure employing air gaps between metal lines and between metal layers'20067,049,246'Method for selective fabrication of high capacitance density areas in a low dielectric constant material'20066,984,577'Damascene interconnect structure and fabrication method having air gaps between metal lines and metal layers'20066,925,645'Fault tolerant server architecture for collaborative computing'20056,900,938'Low dispersion interleaver'20056,838,352'Damascene trench capacitor for mixed-signal/RF IC applications'20056,821,485'Method and structure for microfluidic flow guiding'20046,809,863'Low dispersion filters'20046,787,911'Interconnect with low dielectric constant insulators for semiconductor integrated circuit manufacturing'20046,781,754'Interleaver using spatial birefringent elements'20046,782,158'Apparatus and method for wavelength division multiplexing'20046,740,985'Structure for bonding pad and method for its fabrication'20046,731,430'Low crosstalk flat band filter'20046,693,743'Birefringent devices'20046,687,054'Apparatus and method for low dispersion in communications'20046,684,006'Apparatus and method for wavelength division multiplexing'20046,639,707'Tandem interleaver'20036,627,539'Method of forming dual-damascene interconnect structures employing low-k dielectric materials'20036,628,449'Tandem comb filter'20036,567,813'Quality of service maintenance for distributed collaborative computing'20036,563,641'Fold interleaver'20036,509,623'Microelectronic air-gap structures and methods of forming the same'20036,445,073'Damascene metallization process and structure'20026,444,136'Fabrication of improved low-k dielectric structures'20026,417,094'Dual-damascene interconnect structures and methods of fabricating same'20026,396,122'Method for fabricating on-chip inductors and related structure'20026,329,290'Method for fabrication and structure for high aspect ratio vias'20016,309,922'Method for fabrication of on-chip inductors and related structure'20016,280,794'Method of forming dielectric material suitable for microelectronic circuits'20016,271,127'Method for dual damascene process using electron beam and ion implantation cure methods for low dielectric constant materials'20016,245,663'IC interconnect structures and methods for making same'20016,211,561'Interconnect structure and method employing air gaps between metal lines and between metal layers'20016,198,170'Bonding pad and support structure and method for their fabrication'20016,187,672'Interconnect with low dielectric constant insulators for semiconductor integrated circuit manufacturing'20016,100,184'Method of making a dual damascene interconnect structure using low dielectric constant material for an inter-level dielectric layer'20006,071,809'Methods for forming high-performing dual-damascene interconnect structures'20006,037,664'Dual damascene interconnect structure using low dielectric constant material for an inter-level dielectric layer'20005,891,513'Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications'19995,830,805'Electroless deposition equipment or apparatus and method of performing electroless deposition'19985,824,599'Protected encapsulation of catalytic layer for electroless copper interconnect'19985,736,457'Method of making a damascene metallization'19985,695,810'Use of cobalt tungsten phosphide as a barrier material for copper metallization'19975,674,787'Selective electroless copper deposited interconnect plugs for ULSI applications'19975,660,706'Electric field initiated electroless metal deposition'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2017Based in Irvine, CA, US· patent location history
2002–2007Patents assigned to NEWPORT FAB LLC (14)· patent assignee history
2003–2009Based in San Jose, CA, US· patent location history
2010–2020Patents assigned to ZHAO BIN (33)· patent assignee history
2010–2016Patents assigned to FREESCALE SEMICONDUCTOR INC (18)· patent assignee history
2011–2020Based in Shenzhen, CN· patent location history
2012–2020Based in Shanghai, CN· patent location history
2013–2021Based in Beijing, CN· patent location history
2016–2020Patents assigned to AGORA LAB INC (12)· patent assignee history
2017–2021Patents assigned to BEIJING BOE OPTOELECTRONICS TECH CO LTD (11)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ZHAO BINself | 33 | 2010–2020 |
| FREESCALE SEMICONDUCTOR INC | 18 | 2010–2016 |
| NEWPORT FAB LLC | 14 | 2002–2007 |
| AGORA LAB INC | 12 | 2016–2020 |
| BEIJING BOE OPTOELECTRONICS TECH CO LTD | 11 | 2017–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Irvine, California, US | 66 | 1997–2017 |
| Shanghai, CN | 16 | 2012–2020 |
| Beijing, CN | 12 | 2013–2021 |
| Shenzhen, CN | 10 | 2011–2020 |
| San Jose, California, US | 7 | 2003–2009 |