Method for removing layers of organic material
Granted 1 Aug 1978 · no office action yet
Current assignee: International Business Machines Corporation · originally International Business Machines
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Attorney: Attorney · Log in to unlock
Inventors: Leon H. Kaplan, Nungavaram S. Viswanathan, Steven M. Zimmerman · Examiner: · AU 173 · TC 1700
Life of the patent
2 dated eventsAbstract
organic materials, such as organic polymer resist layers, are removed from substrates by contacting the materials with a mixture consisting essentially of an alkali metal persulfate and concentrated (96%) sulfuric acid wherein the mixture contains from above about 13 to about 50 grams of alkali metal persulfate per 100 milliliters of sulfuric acid.
Classifications
5 codes- G03F7/42
- H05K3/06
- H10P95/00
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5 members · 4 offices›IP5 & PCT — 2 members
| Office | Publication | Kind | Published | Filed | Status | Title |
|---|---|---|---|---|---|---|
| USthis patent | US-T973008-I4 | I4 | 1 Aug 1978 | 9 Dec 1977 | granted | Method for removing layers of organic material |
| JP | JP-S5364769-A | A | 9 Jun 1978 | 19 Oct 1977 | published | Method of removing organic material |
›Other offices — 3 members
| Office | Publication | Kind | Published | Filed | Status | Title |
|---|---|---|---|---|---|---|
| DE | DE-2747669-A1 | A1 | 24 May 1978 | 25 Oct 1977 | published | Verfahren zum abloesen einer organischen schicht von einem substratde |
| FR | FR-2371705-A1 | A1 | 16 Jun 1978 | 7 Oct 1977 | published | Photoresist removal from semiconductor - using persulphate and conc. sulphuric acid, avoiding harmful side-effects and need for special precautions |
| FR | FR-2371705-B1 | B1 | 19 Dec 1980 | 7 Oct 1977 | granted | no title held |
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