USPatentGranted
S1

Ring for a plasma processing apparatus

Granted 28 Jul 2020 · no office action yet

Current assignee: Hitachi High-Tech Instruments Co., Ltd · originally Hitachi, Ltd.

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Inventors: Masakazu Isozaki, Kenetsu Yokogawa, Takao Arase, Taku Iwase +1 · Examiner: Susan Bennett Hattan · AU 2922 · TC 2900

Application
29/688,724
filed 24 Apr 2019
Publication
Not published
not published
Patent· this page
US D891636
granted 28 Jul 2020

Life of the patent

2 dated events
⤢ drag to zoomApr 2019Jul 2019Oct 2019Jan 2020Apr 2020Jul 2020Prosecution
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Description

1 parts
›FIG. 1 is a front, bottom and right…

FIG. 1 is a front, bottom and right side perspective view of a ring for a plasma processing apparatus according to the design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a rear elevational view thereof;

FIG. 8 is a cross-sectional view taken along line 8 - 8 of FIG. 2 ; and,

FIG. 9 is an enlarged view of the portion shown in BOX 9 in FIG. 8 .

The box labelled as 9 in FIG. 8 is shown in broken lines and forms no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

1 codes
USPC · US Patent Classification
D24/224

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File wrapper

Pendency
1.3 y
461 days filing → grant
Office actions
0
none on record
Examiner
Susan Bennett Hattan
art unit 2922 · TC 2900
Citations: 13 back · 0 forward

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Chain of title

⤢ drag to zoom20202022202420262028203020322034203620382040Owner 2
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Worldwide family

3 members · 3 offices
US1JP1TW1
this patentIP5 & PCTother officessolid = grantedhover for detail · click to open
Members
3
DOCDB simple family 67769555
Offices
3
US · JP
Granted
2 of 3
grant date present
Non-English titles
1
shown as filed, never translated
›IP5 & PCT — 2 members
OfficePublicationKindPublishedFiledStatusTitle
USthis patentUS-D891636-SS128 Jul 202024 Apr 2019grantedRing for a plasma processing apparatus
JPJP-1640255-SS2 Sep 201925 Oct 2018grantedno title held
›Other offices — 1 members
OfficePublicationKindPublishedFiledStatusTitle
TWTW-D204229-SS21 Apr 202024 Apr 2019published電漿處理裝置用環zh

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Citations

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