USPatentGranted
S1

Headphone

Granted 17 Jul 2018 · 20 office actions

Current assignee: Sony Corporation · originally Sony Group Corporation

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Inventors: Tomohiro Ito, Shunsuke Shiomi, Hideto Yamamoto, Yosuke Nakamura +2 · Examiner: Paula Allen Greene · AU 2912 · TC 2900

Application
29/465,753
filed 30 Aug 2013
Publication
Not published
not published
Patent· this page
US D823278
granted 17 Jul 2018

Life of the patent

2 dated events
⤢ drag to zoomJul 2013Jan 2014Jul 2014Jan 2015Jul 2015Jan 2016Jul 2016Jan 2017Jul 2017Jan 2018Jul 2018Prosecution
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Description

1 parts
›FIG. 1 is a perspective view of a…

FIG. 1 is a perspective view of a first embodiment of a headphone showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a top plan view thereof; and

FIG. 6 is a bottom plan view thereof.

FIG. 7 is a perspective view thereof wherein the headphone housing is in a first alternate position;

FIG. 8 is a perspective view thereof wherein the headphone housing is in a second alternate position;

FIG. 9 is a perspective view thereof wherein the headphone housing is in a third alternate position;

FIG. 10 is a perspective view thereof wherein the headphone housing is in a fourth alternate position;

FIG. 11 is a rear elevational view thereof wherein the headphone housing is in the first alternate position;

FIG. 12 is a rear elevational view thereof wherein the headphone housing is in the second alternate position; and

FIG. 13 is a rear elevational view thereof wherein the headphone housing is in the third alternate position.

FIG. 14 is a rear elevational view thereof wherein the headphone housing is in the fourth alternate position.

FIG. 15 is a perspective view of a second embodiment of a headphone showing our new design;

FIG. 16 is a front elevational view thereof;

FIG. 17 is a rear elevational view thereof;

FIG. 18 is a left side elevational view thereof;

FIG. 19 is a top plan view thereof; and

FIG. 20 is a bottom plan view thereof.

FIG. 21 is a perspective view thereof wherein the headphone housing is in a first alternate position;

FIG. 22 is a perspective view thereof wherein the headphone housing is in a second alternate position;

FIG. 23 is a perspective view thereof wherein the headphone housing is in a third alternate position;

FIG. 24 is a perspective view thereof wherein the headphone housing is in a fourth alternate position;

FIG. 25 is a rear elevational view thereof wherein the headphone housing is in the first alternate position;

FIG. 26 is a rear elevational view thereof wherein the headphone housing is in the second alternate position;

FIG. 27 is a rear elevational view thereof wherein the headphone housing is in the third alternate position; and

FIG. 28 is a rear elevational view thereof wherein the headphone housing is in the fourth alternate position.

FIG. 29 is a perspective view of a third embodiment of a headphone showing our new design;

FIG. 30 is a front elevational view thereof;

FIG. 31 is a rear elevational view thereof;

FIG. 32 is a left side elevational view thereof;

FIG. 33 is a top plan view thereof; and

FIG. 34 is a bottom plan view thereof.

FIG. 35 is a perspective view thereof wherein the headphone housing is in a first alternate position;

FIG. 36 is a perspective view thereof wherein the headphone housing is in a second alternate position;

FIG. 37 is a perspective view thereof wherein the headphone housing is in a third alternate position;

FIG. 38 is a perspective view thereof wherein the headphone housing is in a fourth alternate position;

FIG. 39 is a rear elevational view thereof wherein the headphone housing is in the first alternate position;

FIG. 40 is a rear elevational view thereof wherein the headphone housing is in the second alternate position;

FIG. 41 is a rear elevational view thereof wherein the headphone housing is in the third alternate position; and

FIG. 42 is a rear elevational view thereof wherein the headphone housing is in the fourth alternate position.

FIG. 43 is a right side elevational view of the embodiment of FIG. 1 ;

FIG. 44 is a right side elevational view of the embodiment of FIG. 15 ; and,

FIG. 45 is a right side elevational view of the embodiment of FIG. 29 .

The broken lines illustrating unclaimed portions of the headphone form no part of the claimed design. Dot-dash broken lines illustrating boundaries of the claimed design form no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

1 codes
USPC · US Patent Classification
D14/205

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File wrapper

Pendency
4.9 y
1,782 days filing → grant
Office actions
10
after a restriction
Responses
6
no RCE
Appeals
1
notices of appeal
Examiner
Paula Allen Greene
art unit 2912 · TC 2900
Citations: 43 back · 0 forward

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Chain of title

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Term & fees

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Validity challenges

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Citations

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