LED package body
Granted 26 Jul 2016 · no office action yet
Current assignee: Suzhou LEKIN Semiconductor Co., Ltd. · originally LG Electronics
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Inventors: Baek Jun Kim, Ha Na Kim, Byung Mok Kim, Hae Jin Park · Examiner: Selina Sikder · AU 2912 · TC 2900
Life of the patent
6 dated eventsDescription
1 parts›FIG. 1 is a perspective view of a…
FIG. 1 is a perspective view of a LED package body showing our new design;
FIG. 2 is a front view thereof where the rear view is a mirror image;
FIG. 3 is a left side view thereof where the right side view is a mirror image;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a cross-sectional view taken along, line 6 - 6 of FIG. 4 .
The broken lines depict portions of the LED package body that form no part of the claimed design.
The cross sectional view shown in FIG. 6 is included for the purpose of showing the interior contours shown in FIG. 1 which may not be clear from the remaining illustrations. Any features of internal construction shown are incidental and form no part of the claimed design.
Claims
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