Headphone assembly
Granted 9 Dec 2014 · no office action yet
Current assignee: Google · originally Alphabet Inc.
Law firm: Law firm · Log in to unlock
Attorney: Attorney · Log in to unlock
Inventors: Michael Kai Morishita, Jianchun Dong, Eliot Kim, Haley Toelle · Examiner: Paula Greene · AU 2912 · TC 2900
Life of the patent
2 dated eventsDescription
1 parts›FIG. 1 is a front perspective view of…
FIG. 1 is a front perspective view of a headphone assembly according to our design shown in a first configuration thereof;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a back elevation view thereof;
FIG. 4 is a right side elevation view thereof;
FIG. 5 is a left side elevation view thereof;
FIG. 6 is a top elevation view thereof;
FIG. 7 is a bottom elevation view thereof;
FIG. 8 is a rear perspective view of the headphone assembly of FIG. 1 , shown in a second configuration thereof;
FIG. 9 is a front elevation view thereof;
FIG. 10 is a back elevation view thereof;
FIG. 11 is a right side elevation view thereof;
FIG. 12 is a left side elevation view thereof;
FIG. 13 is a top elevation view thereof; and,
FIG. 14 is a bottom elevation view thereof.
Broken lines are environmental only and form no part of the claimed design.
Dash-dot lines adjacent un-shaded areas represent bounds of the claimed design and form no part of the claimed design themselves.
Diagonal shading is used to indicate a polished or reflective material or surface treatment.
Stipple-fill areas are used to represent features that can have a fabric surface, including a material of woven or braided fibers.
The pairs of closely adjacent, spaced jagged broken lines in the drawings form no part of the claimed design and the portions between such pairs of jagged broken lines are broken away to disclose indeterminate length. Portions of the design that may be visible between the jagged lines have been removed for clarity.
Claims
1 · 1 independent · depth 1Classifications
1 codesClaim changes
SoonSee which claims were amended, added or cancelled during examination, with every added and removed word marked.
The published claims of this patent are not paired with the granted ones in what we hold.
File wrapper
See the full prosecution history — every USPTO and applicant action on this file, in order.
Log in to unlockChain of title
See the full assignment history — every owner this patent has passed through, with recordation dates and reel/frame numbers.
Log in to unlockTerm & fees
See the term timeline — pendency span, in-force span, the maintenance fees paid and both computed expiry dates.
Log in to unlockWorldwide family
6 members · 2 offices›IP5 & PCT — 6 members
| Office | Publication | Kind | Published | Filed | Status | Title |
|---|---|---|---|---|---|---|
| USthis patent | US-D719132-S | S1 | 9 Dec 2014 | 25 Jun 2013 | granted | Headphone assembly |
| US | US-D743370-S | S1 | 17 Nov 2015 | 15 May 2014 | granted | Headphone assembly |
| US | US-D743932-S | S1 | 24 Nov 2015 | 15 May 2014 | granted | Headphone assembly |
| JP | JP-1509979-S | S | 16 Oct 2017 | 20 Dec 2013 | granted | no title held |
| JP | JP-1516490-S | S | 22 Jan 2018 | 20 Dec 2013 | granted | no title held |
| JP | JP-1516491-S | S | 22 Jan 2018 | 20 Dec 2013 | granted | no title held |
Validity challenges
See the validity challenges on record — reexaminations, IPRs and PGRs, with their institution decisions and outcomes.
Log in to unlockCitations
See every patent this one cites and every patent that cites it back — publication, assignee, and how each one was found.
Log in to unlock