The present application is related to a copending U.S. patent application Ser. No. 12/606,200, titled “Method for Manufacturing Vented Board, Metal Plate for Forming the Vented Board, and Method for Making Electronic Device Having the Vented Board”, the disclosure of which is incorporated herein by reference.

FIG. 1 is a perspective view of a corner portion of a mesh board for an electronic device enclosure showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a back elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken lines of the figures depicting portions of an exemplary panel of an electronic device enclosure including a mesh board according to the claimed design are shown as environmental structure and form no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1

1 granted claims

›1.independentThe ornamental design for a mesh board for electronic device enclosure, as shown and described.

Classifications

1 codes

USPC · US Patent Classification

D13/199

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Pendency

1.4 y

515 days filing → grant

Office actions

non-final + final

Responses

no RCE

Examiner

T. Chase Nelson

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