USPatentGranted
S1

Circuit pack

Granted 18 Mar 2008 · 2 office actions

Current assignee: Ciena Corporation · originally Nortel Networks Corporation

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Attorney: Attorney · Log in to unlock

Inventors: Yim Kwong Ng, Edward Chen, Michael Campbell · Examiner: Selina Sikder · AU 2912 · TC 2900

Application
29/200,741
filed 3 Mar 2004
Publication
Not published
not published
Patent· this page
US D564455
granted 18 Mar 2008

Life of the patent

14 dated events
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Description

1 parts
›FIG. 1 is an isometric view of a…

FIG. 1 is an isometric view of a circuit pack with the door closed showing our design.

FIG. 2 is a front view of the circuit pack with the door closed.

FIG. 3 is an isometric view of the circuit pack with the door open; and,

FIG. 4 is a front view of the circuit pack with the door open.

The top, bottom, and sides of the circuit pack are unornamented.

The broken lines are shown for illustrative purposes only and form no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

1 codes
USPC · US Patent Classification
D13/158

Claim changes

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File wrapper

⤢ drag to zoomJan 2004Jul 2004Jan 2005Jul 2005Jan 2006Jul 2006Jan 2007Jul 2007Jan 2008USPTOApplicantNon-final rejectionNotice of allowance
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Pendency
4.0 y
1,476 days filing → grant
Office actions
1
non-final + final
Responses
1
no RCE
Examiner
Selina Sikder
art unit 2912 · TC 2900
Citations: 10 back · 0 forward

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Chain of title

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Term & fees

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Validity challenges

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Citations

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