A portion of the disclosure of this design patent application document contains material to which a claim for copyright is also made. The copyright owner has no objection to the facsimile reproduction of this design patent application by anyone as it appears in the Patent and Trademark Office patent file or records, but reserves all other copyrights whatsoever.

FIG. 1 is a perspective view of a first embodiment of a molded cable interconnect, in accordance with the present invention.

FIG. 2 is a plan view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.

FIG. 3 is an underside view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.

FIG. 4 is a side view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.

FIG. 5 is a corresponding side view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1, as depicted in FIG. 1.

FIG. 6 is a rear view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.

FIG. 7 is a frontal view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.

FIG. 8 is a perspective view of a second embodiment of a molded cable interconnect, in accordance with the present invention.

FIG. 9 is a plan view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.

FIG. 10 is an underside view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.

FIG. 11 is a side view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.

FIG. 12 is a corresponding side view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.

FIG. 13 is a rear view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8; and,

FIG. 14 is a frontal view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.

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Claims

1 · 1 independent · depth 1

1 granted claims

›1.independentThe ornamental design for a molded cable interconnect, as shown and described.

Classifications

2 codes

USPC · US Patent Classification

D13/146D13/153

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335 days filing → grant

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Joel Sincavage

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