USPatentGranted
S

Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module

Granted 16 Mar 1999 · no office action yet

Current assignee: Siemens Aktiengesellschaft · originally Siemens AG

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Inventors: Frank Puschner, Christian Hauser, Josef Mundigl, Jurgen Fischer +1 · Examiner: Brian N. Vinson · AU 291 · TC 2900

Application
Not granted yet
filed 8 Sep 1997
Publication
Not published
not published
Patent· this page
US D406821
granted 16 Mar 1999

Life of the patent

2 dated events
⤢ drag to zoomOct 1997Jan 1998Apr 1998Jul 1998Oct 1998Jan 1999Apr 1999Prosecution
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Description

1 parts
›The single FIGURE is a top perspective view…

The single FIGURE is a top perspective view of a carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module showing our new design.

The features on the undisclosed bottom are not claimed.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

1 codes
USPC · US Patent Classification
D13/182

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Pendency
1.5 y
554 days filing → grant
Office actions
0
on the grant's record
Examiner
Brian N. Vinson
art unit 291 · TC 2900
Citations: 6 back · 0 forward

Chain of title

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