USPatentGranted
S

Carrier element for a semiconductor chip for integration into a chipcard

Granted 16 Feb 1999 · no office action yet

Current assignee: Siemens Aktiengesellschaft · originally Siemens AG

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Inventors: Peter Stampka, Christian Hauser, Erik Heinemann, Frank Pueschner +1 · Examiner: Brian N. Vinson · AU 291 · TC 2900

Application
Not granted yet
filed 25 Apr 1997
Publication
Not published
not published
Patent· this page
US D405779
granted 16 Feb 1999

Life of the patent

2 dated events
⤢ drag to zoomApr 1997Jul 1997Oct 1997Jan 1998Apr 1998Jul 1998Oct 1998Jan 1999Apr 1999Prosecution
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Description

1 parts
›FIG. 1 is a top, perspective view of…

FIG. 1 is a top, perspective view of a carrier element for a semiconductor chip for integration into a chipcard showing our new design; and,

FIG. 2 is a top plan view thereof.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

1 codes
USPC · US Patent Classification
D14/117

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File wrapper

Pendency
1.8 y
662 days filing → grant
Office actions
0
on the grant's record
Examiner
Brian N. Vinson
art unit 291 · TC 2900
Citations: 7 back · 0 forward

Chain of title

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