Overmold and housing for an interface cable
Granted 24 Jun 1997 · no office action yet
Current assignee: Motorola, Inc. · originally Motorola Solutions, Inc.
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Inventors: Roman P. Rak, William E. Fenton · Examiner: Joel Sincavage · AU 291 · TC 2900
Life of the patent
4 dated eventsDescription
1 parts›FIG. 1 is a perspective view showing a…
FIG. 1 is a perspective view showing a top, right, and front side of a preferred embodiment of our new design for an overmold and housing for an interface cable in accordance with the present invention;
FIG. 2 is a left side elevational view thereof;
FIG. 3 is a rear elevational view thereof; and,
FIG. 4 is a bottom plan view thereof.
Portions of the drawings shown in phantom are provided for reference only and form no part of the design.
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