USPatentGranted
S

Overmolded housing for an interface cable

Granted 10 Sep 1996 · no office action yet

Assignee: Rak Roman P

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Inventors: Roman P. Rak, William E. Fenton · Examiner: Joel Sincavage · AU 291 · TC 2900

Application
Not granted yet
filed 30 Jun 1995
Publication
Not published
not published
Patent· this page
US D373567
granted 10 Sep 1996

Life of the patent

4 dated events
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Description

1 parts
›FIG. 1 is a perspective view showing a…

FIG. 1 is a perspective view showing a top, right, and front side of a preferred embodiment of our new design for an overmolded housing for an interface cable in accordance with the present invention;

FIG. 2 is a left side elevational view thereof;

FIG. 3 is a bottom plan view thereof; and,

FIG. 4 is a rear elevational view thereof.

The broken line showing throughout the drawing figures is included for the purpose of illustrating environmental structure only and forms no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

1 codes
USPC · US Patent Classification
D13/133

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Pendency
1.2 y
438 days filing → grant
Office actions
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Examiner
Joel Sincavage
art unit 291 · TC 2900
Citations: 6 back · 0 forward

Chain of title

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