High density component mounting back panel for electronic equipment

FIG. 1 is a top, front perspective view of a high density component mounting back panel for electronic equipment showing our new design;

FIG. 2 is a bottom rear perspective view thereof;

FIg. 3 is an enlarged top plan view thereof, the mounted receptacle blocks being omitted for purposes of disclosure;

FIG. 4 is an enlarged bottom plan view thereof, the mounted elements being omitted for purposes of disclosure;

FIG. 5 is a side elevational view thereof;

FIG. 6 is a front elevational view thereof; and

FIG. 7 is a rear elevational view thereof.

The characteristic feature of the invention is the front and rear surface ornamentation provided by dark areas of conductive material as shown in FIGS. 3 and 4 and the arrangement of receptacles upon the front and rear surfaces as shown in FIGS. 1, 2, and 5-7. The contrasting dark areas on the circuit board are omitted in FIGS. 1 and 2 for ease of illustration.

The receptacle blocks and the apertures thereon are partially shown for convenience of illustration, it being understood that the receptacles and apertures are continuous across the board and receptacles respectively as indicated by the broken lines.