USPatentGranted
S1

Bone conduction earphone

Granted 10 Mar 2026 · no office action yet

Current assignee: Ningbo Sogen Electronics Technology Co., Ltd. · originally Ningbo Weie Electronics Technology Ltd.

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Inventors: Wei Zhao, Shundong Pan, Ronghua Zhu, Hao Zhang +3 · Examiner: Paula Allen Greene · AU 2912 · TC 2900

Application
29/919,346
filed 4 Dec 2023
Publication
Not published
not published
Patent· this page
US D1117140
granted 10 Mar 2026

Life of the patent

3 dated events
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Description

1 parts
›FIG. 1 is a top and left side…

FIG. 1 is a top and left side perspective view of a bone conduction earphone, showing my new design;

FIG. 2 is a bottom and right side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is an enlarged view of the selected portion 9 in FIG. 1 ;

FIG. 10 is an enlarged view of the selected portion 10 in FIG. 1 ; and,

FIG. 11 is an enlarged view of the selected portion 11 in FIG. 2 .

The broken lines shown in the drawings depict portions of the bone conduction earphone that form no part of the claimed design. The dash-dot broken lines encircling portions of the bone conduction earphone in FIGS. 1 and 2 and illustrated in the enlarged views of FIGS. 9 , 10 and 11 form no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

2 codes
USPC · US Patent Classification
D14/205D14/206

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Pendency
2.3 y
827 days filing → grant
Office actions
0
on the grant's record
Examiner
Paula Allen Greene
art unit 2912 · TC 2900
Citations: 53 back · 0 forward

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