Bone conduction earphone
Granted 10 Mar 2026 · no office action yet
Current assignee: Ningbo Sogen Electronics Technology Co., Ltd. · originally Ningbo Weie Electronics Technology Ltd.
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Inventors: Wei Zhao, Shundong Pan, Ronghua Zhu, Hao Zhang +3 · Examiner: Paula Allen Greene · AU 2912 · TC 2900
Life of the patent
3 dated eventsDescription
1 parts›FIG. 1 is a top and left side…
FIG. 1 is a top and left side perspective view of a bone conduction earphone, showing my new design;
FIG. 2 is a bottom and right side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top plan view thereof;
FIG. 8 is a bottom plan view thereof;
FIG. 9 is an enlarged view of the selected portion 9 in FIG. 1 ;
FIG. 10 is an enlarged view of the selected portion 10 in FIG. 1 ; and,
FIG. 11 is an enlarged view of the selected portion 11 in FIG. 2 .
The broken lines shown in the drawings depict portions of the bone conduction earphone that form no part of the claimed design. The dash-dot broken lines encircling portions of the bone conduction earphone in FIGS. 1 and 2 and illustrated in the enlarged views of FIGS. 9 , 10 and 11 form no part of the claimed design.
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