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2. Combined polishing and grinding device

2 . 1 : Front

2 . 2 : Back

2 . 3 : Left

2 . 4 : Right

2 . 5 : Top

2 . 6 : Perspective

2 . 7 : Perspective

2 . 8 : Perspective

This design is used for polishing and grinding of wafer substrate.

The lightened areas with a broken-line boundary depict portions of the combined polishing and grinding device that form no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1

1 granted claims

›1.independentThe ornamental design for a combined polishing and grinding device as shown and described.

Classifications

2 codes

USPC · US Patent Classification

D15/124D15/122

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Pendency

1.5 y

530 days filing → grant

Office actions

after a restriction

Responses

no RCE

Examiner

Patricia A Palasik

art unit 2918 · TC 2900

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Citations: 31 back · 0 forward

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Worldwide family

5 members · 3 offices

this patentIP5 & PCTother officessolid = grantedhover for detail · click to open

Members

DOCDB simple family 95071292

Offices

US · JP

Granted

3 of 5

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Non-English titles

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›IP5 & PCT — 3 members

Office	Publication	Kind	Published	Filed	Status	Title
USthis patent	US-D1112383-S	S1	10 Feb 2026	29 Aug 2024	granted	Combined polishing and grinding device
JP	JP-1794400-S	S	26 Mar 2025	29 Aug 2024	granted	研磨及び研削機器ja
JP	JP-1799656-S	S	27 May 2025	29 Aug 2024	granted	研磨及び研削機器ja

›Other offices — 2 members

Office	Publication	Kind	Published	Filed	Status	Title
TW	TW-D240377-S	S	11 Sep 2025	15 Nov 2024	published	Polishing and grinding device
TW	TW-D241113-S	S	21 Oct 2025	15 Nov 2024	published	Polishing and grinding device

Validity challenges

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Citations

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