USPatentGranted
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Heat dissipation device

Granted 7 Oct 2025 · no office action yet

Assignee: BITMAIN TECHNOLOGIES INC.

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Inventors: Te Pi, Hongbo Zeng, Shengqiang Xiao, Yurong Peng +6 · Examiner: April Rivas · AU 2921 · TC 2900

Application
29/871,215
filed 15 Feb 2023
Publication
Not published
not published
Patent· this page
US D1096672
granted 7 Oct 2025

Life of the patent

4 dated events
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Description

1 parts
›FIG. 1 is a front, right and bottom…

FIG. 1 is a front, right and bottom perspective view of a heat dissipation device showing our new design;

FIG. 2 is a rear, left and top perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a top view thereof;

FIG. 8 is a bottom view thereof;

FIG. 9 is an enlarged view of an encircled portion 9 of FIG. 1 ;

FIG. 10 is an enlarged view of an encircled portion 10 of FIG. 1 ;

FIG. 11 is an enlarged view of an encircled portion 11 of FIG. 2 ; and,

FIG. 12 is an enlarged view of an encircled portion 12 of FIG. 1 .

The broken lines depict portions of the heat dissipation device in which the design is embodied that form no part of the claimed design. The dash-dot lines illustrate the bounds of the enlarged views and form no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

1 codes
USPC · US Patent Classification
D25/33

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Pendency
2.6 y
965 days filing → grant
Office actions
0
on the grant's record
Examiner
April Rivas
art unit 2921 · TC 2900
Citations: 10 back · 1 forward

Chain of title

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Citations

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