USPatentGranted
S1

Headphone

Granted 10 Sep 2024 · no office action yet

Assignee: Yuhua Zhang

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Inventors: Yuhua Zhang · Examiner: Messina L Smith · AU 2914 · TC 2900

Application
29/938,201
filed 18 Apr 2024
Publication
Not published
not published
Patent· this page
US D1041448
granted 10 Sep 2024

Life of the patent

4 dated events
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Description

1 parts
›FIG. 1 is a front elevational view of…

FIG. 1 is a front elevational view of a headphone showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view thereof;

FIG. 8 is a second perspective view thereof;

FIG. 9 is a third perspective view thereof;

FIG. 10 is a fourth perspective view thereof;

FIG. 11 is an enlarged view of an enclosed portion of the headphone labeled 11 in FIG. 1 ;

FIG. 12 is an enlarged view of an enclosed portion of the headphone labeled 12 in FIG. 1 ;

FIG. 13 is an enlarged view of an enclosed portion of the headphone labeled 13 in FIG. 3 ;

FIG. 14 is an enlarged view of an enclosed portion of the headphone labeled 14 in FIG. 4 ;

FIG. 15 is an enlarged view of an enclosed portion of the headphone labeled 15 in FIG. 7 ;

FIG. 16 is an enlarged view of an enclosed portion of the headphone labeled 16 in FIG. 7 ;

FIG. 17 is an enlarged view of an enclosed portion of the headphone labeled 17 in FIG. 8 ; and,

FIG. 18 is an enlarged view of an enclosed portion of the headphone labeled 18 in FIG. 8 .

The dashed broken lines shown in FIGS. 1 - 2 , 7 - 8 , and 9 - 10 depict portions of the headphone that form no part of the claimed design. The dash broken lines shown in FIGS. 1 , 3 - 4 , and 7 - 8 enclosing portions illustrated in enlargements in FIGS. 11 - 18 form no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

2 codes
USPC · US Patent Classification
D14/205D14/223

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File wrapper

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Pendency
0.4 y
145 days filing → grant
Office actions
0
none on record
Examiner
Messina L Smith
art unit 2914 · TC 2900
Citations: 40 back · 11 forward

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Term & fees

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Citations

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